-Item Name: LOCTITE ECCOBOND UF 3912
-Manufacturer: Henkel
-Technologies: Epoxy
-Color: Black
-Cure Type: Heat cure
-Package Size: Contact to Avantek for details.
-Shelf Life: 9 month
LOCTITE ECCOBOND UF 3912 is a black, one-component epoxy underfill encapsulant specifically designed for flip chip applications. It offers high thermal stability, excellent mechanical strength, and strong adhesion properties. The product is snap-curable, halogen-free, and reworkable, making it a reliable choice for advanced electronic packaging. It features fast flow characteristics, high glass transition temperature (Tg), and superior thermal cycling performance, ensuring stable electrical performance under harsh environmental conditions.
| Properties | Uncured State (Before Mixing) |
|---|---|
| Appearance | Black liquid |
| Viscosity (Brookfield, 25°C) | 3,500 mPa·s (cP) |
| Specific Gravity | 1.6 |
| Thixotropic Index | 1 |
| Work Life (25°C) | 24 hours |
| Shelf Life (-40°C) | 9 months (274 days) |
| Properties | Cured State (After Mixing) |
|---|---|
| Cure Condition | 7 minutes @ 160°C |
| Glass Transition Temperature (Tg) | 127°C |
| Coefficient of Thermal Expansion (CTE) – Below Tg | 28 ppm/°C |
| Coefficient of Thermal Expansion (CTE) – Above Tg | 105 ppm/°C |
| Storage Modulus (DMA @ 25°C) | 8,100 N/mm² (1.17×10⁶ psi) |
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Avantek Viet Nam is a dynamic MRO, direct materials and equipment supplier that brings advanced technological solutions to maximize satisfaction of customers.
We are expert in import and export of adhesives, accessories and equipment in both domestic and cosmetic industrial fields, production and technology research and development.
Our solutions promise to bring best optimal effectiveness along with competitive prices, excellent customer services, dedicated on-site support.
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