-Item Name: LOCTITE ECCOBOND UF 3812
-Manufacturer: Henkel
-Technologies: Epoxy
-Color: Black
-Cure Type: Heat cure
-Package Size: Contact to Avantek for details.
-Shelf Life: 6 months
LOCTITE ECCOBOND UF 3812 is a reworkable epoxy underfill designed for use in CSP, WLCSP, and BGA applications. It flows at room temperature without preheating and cures quickly at moderate temperatures, reducing stress on components. The formulation provides high glass transition temperature (Tg) and high fracture toughness, ensuring excellent protection of solder joints during thermal cycling. This halogen-free material is also compatible with most Pb-free solders and offers stable electrical performance under thermal/humidity bias.
LOCTITE ECCOBOND UF 3812 is used for:
| Property | Uncured (Not Mixed) | Cured (After Mixing & Curing) |
|---|---|---|
| Appearance | Black liquid | Solid |
| Viscosity @ 25°C (mPa·s) | 350 (at shear rate 1,000 s⁻¹) | N/A |
| Specific Gravity | 1.23 | N/A |
| Pot Life @ 25°C | 3 days | N/A |
| Work Life @ 25°C | 1 day | N/A |
| Shelf Life @ -20°C | 180 days (6 months) | N/A |
| Cure Schedule | >10 minutes @ 130°C | Fully cured |
| Glass Transition Temperature (Tg) | N/A | 131°C |
| Coefficient of Thermal Expansion (CTE) | N/A | 48 ppm/°C (below Tg), 175 ppm/°C (above Tg) |
| Storage Modulus @ 25°C (N/mm²) | N/A | 3,004 (435,580 psi) |
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