Applications

LOCTITE® ECCOBOND UF 9000AG-061 – Underfill/Encapsulant

-Item Name: LOCTITE® ECCOBOND UF 9000AG-061
-Manufacturer: Henkel
-Technologies: Epoxy
-Color: Black
-Cure Type: Heat cure
-Package Size: Contact to Avantek for details.
-Shelf Life: 12 months

1. Product Overview

LOCTITE® ECCOBOND UF 9000AG-061 is a black, one-component epoxy underfill encapsulant designed for FCBGA and Cu pillar applications. It provides fast flow, low coefficient of thermal expansion (CTE), and long work life, making it ideal for advanced semiconductor packaging. The material forms a rigid, self-filleting protective seal, enhancing solder joint reliability by dissipating stress and ensuring excellent electrical, thermal, and moisture resistance.

2. Applications

  • Flip chip underfill for FCBGA and Cu pillar packaging
  • High-reliability semiconductor encapsulation
  • Pb-free, low-k applications requiring 260°C reflow capability
  • Stress dissipation for solder joints in high-performance electronics

3. Typical Properties

Properties Uncured State (Before Mixing)
Appearance Black liquid
Specific Gravity (g/cm³) 1.74
Viscosity (Brookfield, 25°C, CP51 @ 5 rpm) 11,930 mPa·s (cP)
Work Life (25°C) 24 hours
Shelf Life (-40°C) 365 days
Properties Cured State (After Mixing)
Cure Schedule 15 min ramp to 100°C, 90 min hold @ 100°C + 15 min ramp to 165°C, 2 hr hold @ 165°C
Alternate Cure Schedule 30 min ramp to 90°C, 4 hr hold @ 90°C + 30 min ramp to 150°C, 2 hr hold @ 150°C
Coefficient of Thermal Expansion (CTE) – Below Tg 19 ppm/°C
Coefficient of Thermal Expansion (CTE) – Above Tg 62 ppm/°C
Glass Transition Temperature (Tg) by TMA 135°C
Glass Transition Temperature (Tg) by DMA 160°C
Storage Modulus (DMA @ 25°C) 15 GPa (15,000 N/mm², 2.18×10⁶ psi)
Storage Modulus (DMA @ 250°C) 0.4 GPa (400 N/mm², 58,000 psi)

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