OWSIL™ TC-5860 Thermally Conductive Compound:
DOWSIL™ TC-5860 is a one-part, gray, non-curing thermally conductive compound designed for high-power electronics. It provides high thermal conductivity, dielectric strength, and material stability with a solvent-free formulation to maintain consistency and ease of application.
3. Typical Properties
| Test Method | Property | Unit | Value |
|---|---|---|---|
| CTM 0176 | One or Two-Part | – | One |
| CTM 0176, ASTM E284 | Color | – | Gray |
| CTM 1094, ASTM D4287 | Viscosity (CP52#, 1RPM) | cP | 350,000 |
| CTM 0044, ASTM D70 | Density | g/cm³ | 3.5 |
| CTM 1163, ISO 22007-2 | Thermal Conductivity | W/m·K | 6.0 |
| ASTM D5470 | Thermal Resistance (40 psi) | °C·cm²/W | 0.111 |
| CTM 1140 | Bond Line Thickness (40 psi) | µm | 40 |
| CTM 0540 | Evaporation (24h at 150°C) | % | 0.045 |
| CTM 0114, ASTM D149 | Dielectric Strength | kV/mm | 8.0 |
| CTM 0249, ASTM D257 | Volume Resistivity | Ω·cm | 8.0 × 10¹¹ |
Stronger Bonding. Cleaner Process. Reliable Performance. If you are looking for an adhesive that combines high adhesion strength, flexibility, and electronic safety, 3320-80 is the
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
As the year draws to a close and the Christmas season arrives, Avantek Viet Nam would like to extend our warmest Christmas greetings to all our valued customers, partners, and friends.
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