OWSIL™ TC-5860 Thermally Conductive Compound:
DOWSIL™ TC-5860 is a one-part, gray, non-curing thermally conductive compound designed for high-power electronics. It provides high thermal conductivity, dielectric strength, and material stability with a solvent-free formulation to maintain consistency and ease of application.
3. Typical Properties
| Test Method | Property | Unit | Value |
|---|---|---|---|
| CTM 0176 | One or Two-Part | – | One |
| CTM 0176, ASTM E284 | Color | – | Gray |
| CTM 1094, ASTM D4287 | Viscosity (CP52#, 1RPM) | cP | 350,000 |
| CTM 0044, ASTM D70 | Density | g/cm³ | 3.5 |
| CTM 1163, ISO 22007-2 | Thermal Conductivity | W/m·K | 6.0 |
| ASTM D5470 | Thermal Resistance (40 psi) | °C·cm²/W | 0.111 |
| CTM 1140 | Bond Line Thickness (40 psi) | µm | 40 |
| CTM 0540 | Evaporation (24h at 150°C) | % | 0.045 |
| CTM 0114, ASTM D149 | Dielectric Strength | kV/mm | 8.0 |
| CTM 0249, ASTM D257 | Volume Resistivity | Ω·cm | 8.0 × 10¹¹ |
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