1. Product Overview

DOWSIL™ TC-2022 is a one-part, thermally conductive silicone adhesive that provides high tensile strength and excellent thermal conductivity. It is heat-curable at moderate temperatures, making it suitable for bonding applications in electronic assemblies.

Key Features & Benefits:

• Heat curable at moderate temperatures (100°C for 15 min).
• No mixing required (one-part system).
• Good thermal conductivity (1.7 W/m-K).
• No added solvents for safer handling.
• High tensile strength for strong adhesion.
• Compatible with heat-sensitive substrates.
• Contains 7 mil glass beads for consistent bond-line thickness.
• Primerless adhesion to many substrates including metals, ceramics, and plastics.

2. Applications

DOWSIL™ TC-2022 is ideal for applications requiring thermal management and reliable adhesion, including:

• Bonding integrated circuit (IC) substrates
• Attaching heat sinks
• Sealing lids and housings
• Manual or automated dispensing applications in electronics