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DOWSIL™ TC-5288 Blue – Thermal Compound – Cooling processors in servers, desktops, notebooks, and game consoles

-Item Name: DOWSIL™ TC-5288 Blue Thermal Compound
-Manufacturer: The Dow Chemical Company
-Technologies: Thermal compound formulated with thermally conductive filler in a polydimethylsiloxane matrix; flowable, solventless, non-curing
-Color: Blue
-Cure Type: Non-curing
-Package Size: Contact to Avantek for details.
-Shelf Life: Contact to Avantek for details.

1. Product Overview

DOWSIL™ TC-5288 Blue Thermal Compound is a blue, flowable, non-curing thermally conductive compound designed for efficient heat dissipation in electronic devices. It has a solventless formulation and can achieve a thin Bond Line Thickness (BLT) for optimal thermal performance. The compound has very low thermal resistance and high thermal conductivity, ensuring heat is effectively conducted away from sensitive components.

2. Applications

  • Cooling of processors in servers, desktops, notebooks, and game consoles
  • Thermal management in PCB system assemblies
  • Heat sink and chassis interface for consumer electronic devices

3. Typical Properties

Property Unit Result
One or Two-part One
Color Blue
Viscosity cP / mPa-sec / Pa-sec 110,000 / 110,000 / 110
Specific Gravity (Uncured) 3.47
Non-Volatile Content (NVC) % 99.95
Thermal Conductivity W/m·K 2.9
Thermal Resistance (at 40 psi) °C·cm²/W 0.03
Bond Line Thickness (at 40 psi) mm / inch / mils 0.007 / 0.0003 / 0.3
Dielectric Strength volts/mil / kV/mm 227 / 8.9
Volume Resistivity ohm·cm 6E+11
Dielectric Constant (at 1 kHz) 7.4
Dissipation Factor (at 1 kHz) 0.0003

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