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DOWSIL™ TC-5121C LV Thermally Conductive Compound – Adhesive/Sealant – Thermal Management

-Item Name: DOWSIL™ TC-5121C LV Thermally Conductive Compound
-Manufacturer: Dow
-Technologies: Filled polydimethylsiloxane
-Color: Greenish yellow
-Cure Type: Non-curing
-Package Size: Contact to Avantek for details.
-Shelf Life: Contact to Avantek for details.

1. Product Overview

DOWSIL™ TC-5121C LV is a greenish-yellow, flowable, non-curing thermally conductive compound designed for heat management in electronic assemblies. The material features an optimized polymer matrix that reduces pump-out, provides low thermal resistance, and enables effective heat removal from PCB system components. It does not require curing and can achieve a thin Bond Line Thickness (BLT) for enhanced thermal performance.

2. Applications

  • Used as a thermal interface material for mid to high-end PCB system assemblies.
  • Helps transfer heat efficiently from electrical components to heat sinks or chassis.
  • Suitable for compact electronic devices with high heat generation.
  • Can be applied via screen printing, stencil printing, or dispensing methods.

3. Typical Properties

Property Unit Value
One-part or Two-part One-part
Color Greenish yellow
Viscosity Pa·s / cP 79.0 / 79,000
Thixotropy 1.69
Specific Gravity (Uncured) 4.2
Non-Volatile Content (NVC) % 99.3
Thermal Conductivity W/m·K 2.8
Thermal Resistance @ 40 psi °C·cm²/W 0.09
Dielectric Strength kV/mm 1.89
Dielectric Strength Volts/mil 47.3
Volume Resistivity ohm·cm 1.3E+13
Dielectric Constant @ 1 kHz 14.0
Dissipation Factor @ 1 kHz 0.073

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