
High Performance Epoxy for Drone Manufacturing
Advanced Epoxy Adhesive Solutions for Next-Generation UAVs and Drones As UAV and drone technology continues to evolve, manufacturers require adhesive solutions that can withstand demanding
DOWSIL™ TC-4535 CV is a two-part, thermally conductive silicone gap filler with a thermal conductivity of 3.4 W/m·K. It is designed for efficient heat dissipation in electronic applications, offering room temperature or heat-accelerated curing. Once cured, it remains soft and compliant, providing excellent thermal management for components operating up to 150°C, with peak stability at 175°C.
DOWSIL™ TC-4535 CV is designed for use in thermal management applications, particularly for PCB module assemblies where heat dissipation is crucial. It is commonly used in:
| Property | Test Method | Unit | Part A | Part B |
|---|---|---|---|---|
| Color | CTM 0176, ASTM E284 | – | White | Blue |
| Viscosity at 10 s⁻¹ | CTM 1094, ASTM D4287 | Pa·s | 200 | 230 |
| Mix Ratio (Weight/Volume) | CTM 0176 | – | 1:1 | 1:1 |
| Property | Test Method | Unit | Result |
|---|---|---|---|
| Viscosity at 10 s⁻¹ (Mixed) | CTM 1094, ASTM D4287 | Pa·s | 205 |
| Thixotropic Index | CTM 1094, ASTM D4287 | – | 3.6 |
| Working Time at 25°C | CTM 1094, ASTM D4287 | Min | 60 |
| Cure Time at 25°C | CTM 0099, ASTM D2240 | Min | 120 |
| Durometer Hardness (Shore 00) | CTM 0099, ASTM D2240 | – | 52 |
| Specific Gravity (Cured) | CTM 0022, ASTM D792 | – | 3.1 |
| Thermal Conductivity | CTM 1163, ISO 22007-2 | W/m·K | 3.4 |
| Thermal Resistance (120 μm) | ASTM D5470 | °C·cm²/W | 0.45 |
| Dielectric Strength | CTM 0114, ASTM D149 | kV/mm | 22 |
| Volume Resistivity | CTM 0249, ASTM D257 | Ω·cm | 3E+13 |
| Dielectric Constant (1 MHz) | CTM 0112, ASTM D150 | – | 6.5 |
| Dissipation Factor (1 MHz) | CTM 0112, ASTM D150 | – | 0.005 |
| UL Flame Classification | UL 94 | – | V0 |
| Shelf Life | – | Days | 360 |

Advanced Epoxy Adhesive Solutions for Next-Generation UAVs and Drones As UAV and drone technology continues to evolve, manufacturers require adhesive solutions that can withstand demanding

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