DOWSIL™ TC-5515 LT Low Density Thermally Conductive Gap Filler:

1. Product Overview

DOWSIL™ TC-5515 LT is a two-part, thermally conductive silicone gap filler with a thermal conductivity of 2.0 W/m·K. It offers low density, soft compliance, and stress relief, making it suitable for dissipating heat in electronic devices. The material cures at room temperature but can be heat-accelerated for faster curing. Once cured, it maintains a tacky surface for easy rework and holds its position in vertical applications.

Key Features & Benefits:
✔ Thermal conductivity: 2.0 W/m·K
✔ Soft and compliant, providing stress relief and vibration absorption
✔ Non-flowable after dispensing, holds position in vertical applications
✔ Room-temperature curing with an optional heat-accelerated cure
✔ Surface tacky after curing for easy rework
✔ UL 94 V0 flame retardancy

2. Applications

DOWSIL™ TC-5515 LT is designed for heat dissipation in electronic and electrical applications, particularly in:

• EV battery modules and control unit modules
• Printed circuit boards (PCBs)
• Other heat-generating electronic components
• Automotive and industrial power electronics

This gap filler enhances thermal management by ensuring efficient heat transfer between heat sources (such as EV modules) and heat sinks (such as aluminum housings).