
FX219G5 – Silicone Potting & Encapsulation Compound
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
Product Overview
DOWSIL™ CN-8760 G Thermally Conductive Encapsulant is a two-part, 1:1 mix ratio silicone elastomer designed for efficient heat dissipation and protection of electronic components. It offers room temperature curing with the option to accelerate the process through heat, providing flexibility in manufacturing. The encapsulant exhibits low viscosity and good flowability, facilitating easy mixing and application, which is beneficial for fast processing and short cycle times. Additionally, it is UL 94 V-0 certified, indicating excellent flame resistance.
Applications
This encapsulant is suitable for a variety of applications, including:
Typical Properties
The typical properties of DOWSIL™ CN-8760 G Thermally Conductive Encapsulant are as follows:
| Property | Unit | Value |
|---|---|---|
| Color | – | Gray |
| Viscosity (Part A) | cP (Pa·s) | 2,900 (2.9) |
| Viscosity (Part B) | cP (Pa·s) | 3,200 (3.2) |
| Viscosity (Mixed) | cP (Pa·s) | 3,200 (3.2) |
| Thermal Conductivity | W/m·K | 0.67 |
| Specific Gravity (Cured) | – | 1.58 |
| Working Time at 25°C (Pot Life) | minutes | 100 |
| Cure Time at 25°C | hours | 24 |
| Durometer | Shore A | 45 |
| Dielectric Strength | volts/mil (kV/mm) | 625 (24) |
| Volume Resistivity | ohm·cm | 1.0 × 10¹⁶ |
| Dielectric Constant at 100 Hz | – | 2.88 |
| Dielectric Constant at 100 kHz | – | 2.66 |
| Dissipation Factor at 100 Hz | – | 0.03 |
| Dissipation Factor at 100 kHz | – | 0.06 |
| UL 94 Flame Classification | – | V-0 |
| UL RTI Rating | °C | 150 |

Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.

FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.

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