
High Performance Epoxy for Drone Manufacturing
Advanced Epoxy Adhesive Solutions for Next-Generation UAVs and Drones As UAV and drone technology continues to evolve, manufacturers require adhesive solutions that can withstand demanding
Product Overview
DOWSIL™ CN-8760 Thermally Conductive Encapsulant is a two-part silicone material designed for encapsulating electronic components. It features a 1:1 mixing ratio and can cure at room temperature or with heat, providing manufacturing flexibility. The cured product is a gray elastomer with moderate thermal conductivity, low viscosity, and good flowability, making it suitable for applications requiring efficient heat dissipation and fast processing times. Additionally, it is UL 94 V-0 certified, indicating excellent flame resistance.
Applications
DOWSIL™ CN-8760 is suitable for use in:
Typical Properties
| Property | Unit | Value |
|---|---|---|
| Color | – | Dark Gray |
| Viscosity (Part A) | cP (Pa·s) | 2,400 (2.4) |
| Viscosity (Part B) | cP (Pa·s) | 2,397 (2.4) |
| Viscosity (Mixed) | cP (Pa·s) | 2,850 (2.8) |
| Thermal Conductivity | W/m·K | 0.66 |
| Specific Gravity (Cured) | – | 1.60 |
| Working Time at 25°C (Pot Life) | minutes | 120 |
| Heat Cure Time at 50°C | minutes | 40 |
| Durometer | Shore A | 52 |
| Dielectric Strength | volts/mil (kV/mm) | 838 (33) |
| Volume Resistivity | ohm·cm | >1×10¹⁶ |
| Dissipation Factor at 100 Hz | – | 0.0173 |
| Dissipation Factor at 100 kHz | – | 0.0025 |
| Dielectric Constant at 100 Hz | – | 2.8287 |
| Dielectric Constant at 100 kHz | – | 2.7843 |
| Linear Coefficient of Thermal Expansion (CTE) | µm/m·°C (ppm) | 265 |
| UL 94 Flame Classification | – | V-0 |

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