Brand: Bostik
Product Number: Thermelt 861 Black
Technology: Polyamide Hot Melt Resin
Color: Black
Cure Type: Low-Pressure Molding
Package Size: 20Kg bag (pellets)
Shelf Life: 18 months
Bostik Thermelt 861 Black is a non-reactive, solvent-free polyamide hot melt resin specially designed for low-pressure molding applications. It is widely used for molding electronic and electrical components, connectors, and cables due to its excellent adhesion, low processing temperature, and high flexibility. The material complies with UL94 V-0 flame resistance (UL file E116659), making it ideal for applications requiring fire retardancy and environmental durability.
| Property | Value | Standard Test |
|---|---|---|
| Viscosity (220°C, SC4, 50 RPM) | 2.7–4.2 Pa.s | ASTM D3236 |
| Softening Point | 154–166°C | ASTM D3461 |
| Water Content | <0.2% | Bostik Internal Test |
| Commercial Shape | Pellets | — |
| Property | Value | Standard Test |
|---|---|---|
| Vicat Temperature (A 120, 10N, 120°C/h) | 43°C | ISO 306 |
| Glass Transition (DSC) | -30°C | Bostik Internal Test |
| GWFI (Glow Wire Flammability Index) | 960°C | UL746A |
| GWTI (Glow Wire Ignition Temperature) | 700°C | UL746A |
| Property | Value | Standard Test |
|---|---|---|
| Yield Strength (50 mm/min, 23°C) | 4.1 MPa | ISO 527 |
| Strength at Break (50 mm/min, 23°C) | 4.0 MPa | ISO 527 |
| Elongation at Break (50 mm/min, 23°C) | 310% | ISO 527 |
| Young’s Modulus (50 mm/min, 23°C) | 49 MPa | ISO 527 |
| Property | Value | Standard Test |
|---|---|---|
| Density | ~1 | Internal Test |
| Water Absorption (Immersed, 23°C) | 2.8% | ISO 62 |
| Hardness (Shore D, 23°C) | 38 | ISO 868 |
| Parameter | Value |
|---|---|
| Melt Temperature Range | 190–210°C |
| Mold Temperature Range | 20–60°C |
| Drying Time (Air Oven, Thin Layer) | 8 hours |
| Drying Temperature | 70°C |
| Processing Moisture Content | <0.2% |
Stronger Bonding. Cleaner Process. Reliable Performance. If you are looking for an adhesive that combines high adhesion strength, flexibility, and electronic safety, 3320-80 is the
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
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As the year draws to a close and the Christmas season arrives, Avantek Viet Nam would like to extend our warmest Christmas greetings to all our valued customers, partners, and friends.
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