Brand: Bostik
Product Number: Thermelt 195 Natural
Technology: Polyamide Hot Melt Resin
Color: Natural
Cure Type: Low-Pressure Molding
Package Size: 20Kg bag (pellets)
Shelf Life: 18 months
Bostik Thermelt 195 Natural is a pure copolymer polyamide hot melt resin designed for low-pressure molding applications. It provides high strength and hardness, ensuring reliable encapsulation of electronic components, connectors, and cables. This adhesive is non-reactive, solvent-free, and offers moderate flame resistance (UL94 V-2, UL file E116659).
| Property | Value | Standard Test |
|---|---|---|
| Viscosity (232°C, SC4, 50 RPM) | 4.0–5.0 Pa.s | ASTM D3236 |
| Softening Point | 197–204°C | ASTM D3461 |
| Water Content | <0.2% | Bostik Internal Test |
| Commercial Shape | Pellets | — |
| Property | Value | Standard Test |
|---|---|---|
| Vicat Temperature (A 120, 10N, 120°C/h) | 88°C | ISO 306 |
| Glass Transition Temperature (DSC) | -35°C | Bostik Internal Test |
| Temperature Brittleness | -5°C | ISO 812 |
| GWFI (Glow Wire Flammability Index) | 960°C | UL746A |
| GWTI (Glow Wire Ignition Temperature) | 775°C | UL746A |
| Property | Value | Standard Test |
|---|---|---|
| Yield Strength (50 mm/min, 23°C) | 10.2 MPa | ISO 527 |
| Strength at Break (50 mm/min, 23°C) | 13.2 MPa | ISO 527 |
| Elongation at Break (50 mm/min, 23°C) | 580% | ISO 527 |
| Young’s Modulus (50 mm/min, 23°C) | 240 MPa | ISO 527 |
| Property | Value | Standard Test |
|---|---|---|
| Density | ~1 | Internal Test |
| Water Absorption (23°C, Immersed) | 1.2% | ISO 62 |
| Hardness (Shore D, 23°C) | 56 | ISO 868 |
| Parameter | Value |
|---|---|
| Melt Temperature Range | 210–230°C |
| Mold Temperature Range | 20–60°C |
| Drying Time (Air Oven, Thin Layer) | 8 hours |
| Drying Temperature | 70°C |
| Processing Moisture Content | <0.2% |
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