Applications

LOCTITE® ECCOBOND UF 3712 – Edgebond, Encapsulation

-Item Name: LOCTITE® ECCOBOND UF 3712
-Manufacturer: Henkel
-Technologies: Epoxy
-Color: Black
-Cure Type: Heat cure
-Package Size: Contact to Avantek for details.
-Shelf Life: 6 months

1. Product Overview

LOCTITE® ECCOBOND UF 3712 is a one-component epoxy adhesive designed for edgebond and encapsulation applications. It enhances reliability performance for big chips by providing a uniform and void-free encapsulant. The formulation improves temperature cycling capability and distributes stress away from solder connections.

Key Features:

  • Fast heat cure
  • Thixotropic behavior
  • Good balance between reworkability and reliability
  • ROHS, REACH, and halogen-free compliant
  • Operating temperature: -40°C to 125°C

2. Applications

  • Edgebond and encapsulation for big chip packages
  • Enhances reliability by reducing stress on solder joints
  • Ideal for applications requiring void-free encapsulation and thermal cycling durability

3. Typical Properties

Uncured Material

Property Value
Appearance Black liquid
Viscosity (25°C, 20 rpm) 11,600 mPa.s
Thixotropic Index (2/20 rpm) 3.8
Specific Gravity (25°C) 1.57
Work Life (25°C) ≥24 hours
Shelf Life (-20°C) 180 days

Curing Performance

Cure Schedule Condition
Standard Cure 30 min @ 125°C

Cured Material

Property Value
Coefficient of Thermal Expansion (CTE)
– Below Tg 32 µm/m/K
– Above Tg 115 µm/m/K
Glass Transition Temperature (Tg) 133°C
Tensile Modulus (DMA)
– @ 25°C 7,800 MPa
– @ 125°C 2,500 MPa
Cure Shrinkage (Volume) 1.6%
Water Absorption (168h, 85°C, 85% RH) 0.5%
Die Shear Strength (2x1x0.5mm³ FR4) 11 kgf

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