-Item Name: LOCTITE® ECCOBOND UF 3808
-Manufacturer: Henkel
-Technologies: Epoxy
-Color: Black
-Cure Type: Heat cure
-Package Size: Contact to Avantek for details.
-Shelf Life: 12 months
Product Name: LOCTITE® ECCOBOND UF 3808
Technology: Epoxy
Appearance: Black liquid
Components: One-component
Cure Type: Heat cure
Key Benefits:
Application: Underfill
Typical Assembly Applications: Chip scale packages (CSP) and ball grid arrays (BGA)
LOCTITE® ECCOBOND UF 3808 is a capillary underfill designed to:
| Property | Value |
|---|---|
| Viscosity (mPa·s) @ 1,000 s⁻¹ | 348 |
| Specific Gravity | 1.16 |
| Pot Life @ 25°C (25% viscosity increase) | 3 days |
| Shelf Life @ -20°C | 365 days |
| Cure Schedule | Time & Temperature |
|---|---|
| Standard Cure | ≥8 minutes @ 130°C |
| Alternative Cure | 5 minutes @ 150°C |
| Property | Value |
|---|---|
| Coefficient of Thermal Expansion (ppm/°C) Below Tg | 55 |
| Coefficient of Thermal Expansion (ppm/°C) Above Tg | 171 |
| Glass Transition Temperature (Tg) (°C) | 113 |
| Storage Modulus @ 25°C (N/mm² / psi) | 2,610 / 379,000 |
| Property | Value |
|---|---|
| Dielectric Constant @ 23°C, 1 GHz | 3.19 |
| Dissipation Factor @ 23°C, 1 GHz | 0.0099 |
| Dielectric Constant @ 23°C, 2 GHz | 3.24 |
| Dissipation Factor @ 23°C, 2 GHz | 0.0088 |
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Avantek Viet Nam is a dynamic MRO, direct materials and equipment supplier that brings advanced technological solutions to maximize satisfaction of customers.
We are expert in import and export of adhesives, accessories and equipment in both domestic and cosmetic industrial fields, production and technology research and development.
Our solutions promise to bring best optimal effectiveness along with competitive prices, excellent customer services, dedicated on-site support.
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