Applications

DOWSIL™ TC-4530 CV Thermally Conductive Gap Filler

  • Technology: Thermally Conductive Silicone Gap Filler
  • Brand Name: DOWSIL™ TC-4530 CV Thermally Conductive Gap Filler
  • Manufacturer: Dow Chemical Company
  • Package Size: Contact Avantek for details
  • Shelf Life: 6 months

1. Product Overview

  • Type: Two-part silicone-based thermally conductive gap filler
  • Thermal Conductivity: 3.0 W/m·K
  • Curing: Room temperature or heat-accelerated cure
  • Key Features:
    • Controlled silicone volatility
    • High dispense flow rate
    • Low compression stress
    • No reaction by-products
    • Long-term performance stability under temperature and humidity cycling
    • Low abrasion and low density
    • Glass beads option available (250 µm)
  • Composition:
    • Silicone polymer matrix for reliability
    • Treated ceramic fillers for high thermal conductivity and low abrasion
    • Platinum cure system for fast, controlled cure

2. Applications

  • Designed for heat dissipation in automotive electronics.
  • Suitable for engine control units (ECUs), transmission control units (TCUs), and other PCB-mounted modules.
  • Compatible with automated dispensing using meter-mix equipment.
  • Provides thermal management, electrical insulation, and stress relief over a wide temperature and humidity range.

3. Typical Properties

Before Mixing (Uncured State)

Property Unit Part A Part B
Color White Blue
Viscosity (10 s⁻¹) Pa·s 50 50
Mix Ratio (by weight/volume) 1:1 1:1
Thixotropic Index (1 s⁻¹ / 10 s⁻¹) 5 (Mixed)

After Mixing (Cured State)

Property Unit Result
Density at 25°C g/cm³ 2.6
Thermal Conductivity at 25°C W/m·K 3.0
Working Time at 25°C minutes 60
Cure Time at 25°C hours 18
Cure Time at 50°C hours 2
Cure Time at 80°C hours 1
Hardness (Shore 00) 65
Lap Shear Strength (Al/Al) MPa 0.13
Volume Resistivity Ohm·cm 1.9 × 10¹⁴
Dielectric Strength kV/mm 8
Dielectric Constant (1 MHz) 4.78
Dissipation Factor (1 MHz) 1.2 × 10⁻²
Cyclosiloxane content (D4-D10) ppm < 100
Outgassing (TML / CVCM) % 0.14 / 0.06
Minimum Bondline Thickness µm < 200
UL Flame Classification V0
Operating Temperature Range °C -45 to 125 (short-term up to 200°C)
Shelf Life at 25°C months 6

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