Applications

DOWSIL™ TC-8225 Thermally Conductive Gap Filler

  • Technology: Thermally Conductive Gap Filler (Two-Part Silicone)
  • Brand Name: DOWSIL™ TC-8225 Thermally Conductive Gap Filler
  • Manufacturer: Dow Chemical Company
  • Package Size: Contact Avantek for details.
  • Shelf Life: 10 months (300 days)

1. Product Overview

DOWSIL™ TC-8225 is a two-part thermally conductive silicone gap filler designed for PCB system assembly applications. It offers:

  • Thermal conductivity: 2.5 W/m·K
  • Room temperature cure with accelerated heat curing
  • Long-term stability during temperature cycling up to 150°C, with peak exposure to 200°C
  • Glass beads (180 microns) to ensure controlled bond line thickness
  • Soft and compressible for effective heat dissipation from heat-generating components to heat sinks

2. Applications

  • PCB system assembly: Fills gaps between heat-producing components and heat sinks
  • Automated process integration: Suitable for meter-mix dispense equipment
  • Thermal management: Provides heat dissipation and electrical insulation

3. Typical Properties

Before Mixing

Property Unit Part A Part B
Color White Blue
Viscosity Pa.s 209 195
Specific Gravity

After Mixing

Property Unit Value
Mix Ratio (Weight/Volume) 1:1
Mixed Viscosity Pa.s 200
Thixotropic Index (1 s⁻¹ /10 s⁻¹) 4.2
Working Time at 25°C (Viscosity after 1 hour) Pa.s 490
Cure Time at 25°C minutes 120
Cure Time at 80°C minutes 10
Hardness Shore 00 55
Thermal Conductivity W/m.K 2.7
Volume Resistivity Ohm.cm 2.4E+14
Dielectric Strength (280 micron) kV/mm 44
Shelf Life (25°C) days 300

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