
High Performance Epoxy for Drone Manufacturing
Advanced Epoxy Adhesive Solutions for Next-Generation UAVs and Drones As UAV and drone technology continues to evolve, manufacturers require adhesive solutions that can withstand demanding
DOWSIL™ TC-6032 Thermally Conductive Encapsulant is a two-part, 1:1 mix ratio, flowable silicone elastomer with thermal conductivity designed for electronic component encapsulation. It provides heat dissipation, self-leveling properties, and a versatile heat cure process, forming a thermally conductive rubber upon curing.
| Property | Unit | Part A | Part B |
|---|---|---|---|
| Color | – | White | Blue |
| Viscosity | mPa·s | 8,000 | 4,000 |
| Specific Gravity | – | 2.73 | 2.73 |
| Property | Unit | Result |
|---|---|---|
| Mixing Ratio (by weight) | – | 1:1 |
| Mixed Viscosity | mPa·s | 6,500 |
| Pot Life (Working Time at 25°C) | Hours | 4 |
| Cure Time at 80°C | Minutes | 60 |
| Cure Time at 100°C | Minutes | 30 |
| Cure Time at 120°C | Minutes | 20 |
| Hardness (Shore A) | – | 34 |
| Thermal Conductivity | W/m·K | 3.2 |
| Tensile Strength | MPa | 0.5 |
| Elongation at Break | % | 45 |
| Shear Modulus (25°C) | MPa | 1.55 |
| Dielectric Strength | kV/mm | 18 |
| Volume Resistivity | Ohm·cm | 1.3 × 10¹⁴ |
| Dielectric Constant (100 Hz) | – | 3.22 |
| Dielectric Constant (100 kHz) | – | 3.66 |
| Dissipation Factor (100 Hz) | – | 0.0029 |
| Dissipation Factor (100 kHz) | – | 0.0023 |
| Coefficient of Thermal Expansion (CTE) | ppm/K | 80 |
| Volatile Siloxane Content (D4-D10) | ppm | < 100 |
| Adhesion Strength on Al (80°C / 60 min) | MPa | 0.38 |
| Adhesion Strength on Al (100°C / 30 min) | MPa | 0.38 |
| Adhesion Strength on Al (120°C / 20 min) | MPa | 0.44 |
| Flammability Rating (UL 94) | – | V-0 |

Advanced Epoxy Adhesive Solutions for Next-Generation UAVs and Drones As UAV and drone technology continues to evolve, manufacturers require adhesive solutions that can withstand demanding

Stronger Bonding. Cleaner Process. Reliable Performance. If you are looking for an adhesive that combines high adhesion strength, flexibility, and electronic safety, 3320-80 is the

Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.

FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
Avantek Viet Nam is a dynamic MRO, direct materials and equipment supplier that brings advanced technological solutions to maximize satisfaction of customers.
We are expert in import and export of adhesives, accessories and equipment in both domestic and cosmetic industrial fields, production and technology research and development.
Our solutions promise to bring best optimal effectiveness along with competitive prices, excellent customer services, dedicated on-site support.
Office address: The Verosa Park, 39 street 10, Quarter 2, Long truong Ward, Ho Chi Minh City, Viet Nam
Website: avantek.vn
Email 1: info@avantek.vn
Email 2: long.pham@avantek.vn
Tel: (+84) 944 415 762
Copyright © AVANTEK VN CO., LTD
Leave your information or contact via Hotline, our Customer Support Technical team will contact you immediately!