Products

DOWSIL™ TC-6015 Thermally Conductive Encapsulant

  • Technology: Thermally Conductive Silicone Encapsulant
  • Brand Name: DOWSIL™ TC-6015 Thermally Conductive Encapsulant
  • Manufacturer: Dow Chemical Company
  • Package size: Contact Avantek for details.
  • Shelf life: Contact Avantek for details.

1. Product Overview

DOWSIL™ TC-6015 is a two-part, thermally conductive silicone encapsulant designed for electronics protection and thermal management. It offers high flowability, low density, excellent flame retardancy (UL 94 V-0), and self-adhesion. The product cures at room temperature with an optional heat acceleration for manufacturing flexibility.

2. Applications

DOWSIL™ TC-6015 is suitable for encapsulating and protecting electronic components in:

  • PV inverters
  • Energy storage systems
  • Automotive control units / EV modules
  • High-power modules

3. Typical Properties

Property Unit Part A (Before Mixing) Part B (Before Mixing) Mixed (After Mixing)
Color White to Off-white Grey Grey
Viscosity mPa·s 4,300 3,600 4,000
Pot Life (25°C) minutes 90
Specific Gravity g/cm³ 2.25
Heat Cure Time (70°C) minutes 30
Durometer Hardness Shore A 40
Thermal Conductivity W/m·K 1.6
Tensile Strength MPa 0.7
Elongation % 30
Lap Shear Strength (AL/AL, 24h at RT) MPa 0.6
Dielectric Strength kV/mm 15.3
Volume Resistivity Ohm·cm 4.9E+14
Linear Coefficient of Thermal Expansion (CTE) ppm/°C 108
UL Flammability Rating UL94 V-0

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