Products

SYLGARD™ 567 Primerless Silicone Encapsulant

  • Technology: Two-part, primerless silicone encapsulant
  • Brand Name: SYLGARD™ 567 Primerless Silicone Encapsulant
  • Manufacturer: Dow Chemical Company
  • Package Size: Contact Avantek for details
  • Shelf Life: Contact Avantek for details

1. Product Overview

SYLGARD™ 567 Primerless Silicone Encapsulant is a two-part, black, heat-cure silicone encapsulant with good flame resistance and excellent dielectric properties. It features a 1:1 mix ratio, low viscosity for better flow and fill, and requires no additional priming.

Key Features & Benefits

  • 1:1 mix ratio for easy processing
  • Flowable and self-priming
  • UL 94 V-0 flame resistance
  • Rapid curing controlled by temperature
  • Excellent dielectric and insulation properties
  • No additional priming required for adhesion
  • Low viscosity for better penetration into narrow spaces

Composition

  • Two-part, primerless silicone encapsulant

2. Applications

SYLGARD™ 567 is suitable for general potting and encapsulation in various applications, including:

  • Electronics & Industrial: Power supplies, automotive assemblies, industrial controls, amplifiers, relays, and high-voltage resistor packs
  • LED & Lighting: Encapsulation of LED components
  • Renewable Energy: Solar cell encapsulation
  • Electrical Components: Connectors and insulation for critical systems

3. Typical Properties

Unmixed Components

Property Unit Part A Part B
Color Black Black
Viscosity cP (Pa·s) 1700 (1.7) 1600 (1.6)
Specific Gravity 1.24 1.24

Mixed & Cured Properties

Property Unit Result
Mix Ratio 1:1
Cure Time at 70°C Minutes 180
Cure Time at 100°C Minutes 120
Durometer Hardness Shore A 40
Thermal Conductivity W/m·K 0.29
Dielectric Strength kV/mm (Volts/mil) 16 (405)
Volume Resistivity Ohm·cm 6 × 10¹⁶
Dielectric Constant (100 Hz) 2.85
Dielectric Constant (100 kHz) 2.79
Dissipation Factor (100 Hz) 0.008
Dissipation Factor (100 kHz) 0.002
Linear Coefficient of Thermal Expansion (CTE) ppm 300

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