SHIMOKOTE 9 (…) + Hardener 61 / Hardener 43 based on its technical data sheet.
SHIMOKOTE 9 (…) is a medium-viscosity, filled, liquid epoxy-based compound designed for the electrical and electronics industry. It is formulated for ease of use, pre-filled with dried inorganic fillers, blended thoroughly, and degassed under high vacuum to ensure void-free encapsulation.
When combined with:
✔ Pore-free encapsulation for enhanced insulation.
✔ Good adhesion to various substrates.
✔ Excellent mechanical and electrical properties.
✔ Resistant to water and chemicals.
✔ Low shrinkage during curing.
✔ Easy machining & processing.
Ideal for potting, sealing, and casting of small to medium-sized electrical & electronic components, including:
| Property | Value |
|---|---|
| Color & Appearance | Plain / Black, bubble-free slurry liquid |
| Viscosity at 25°C | 8000 – 14000 mPa.s |
| Density at 25°C | 1.48 – 1.68 g/ml |
| Flash Point (Open Cup) | >100°C |
| Storage Stability (Sealed Container at RT) | 6 months |
| Property | Hardener 61 | Hardener 43 |
|---|---|---|
| Type | Aliphatic Polyamine | Polyamide Amine |
| Color & Appearance | Colorless to pale yellow liquid | Dark brown to orange liquid |
| Viscosity at 25°C | 28 – 40 mPa.s | 300 – 700 mPa.s |
| Density at 25°C | 0.972 – 0.982 g/ml | 0.97 ± 0.1 g/ml |
| Amine Value | 1300 – 1400 mg KOH/g | 340 – 460 mg KOH/g |
| Flash Point (Open Cup) | >100°C | >100°C |
| Storage Stability | 12 months | 12 months |
| Property | SHIMOKOTE 9 + Hardener 61 | SHIMOKOTE 9 + Hardener 43 |
|---|---|---|
| Mixing Ratio (Resin : Hardener) | 100:5 ±0.5 | 100:25 ±1.5 |
| Initial Viscosity of Mixture at 25°C | 3800 mPa.s | 2400 mPa.s |
| Pot Life at 25°C | 45 min | 160 – 200 min |
| Gel Time at 25°C | 55 min | 190 – 230 min |
| Condition | SHIMOKOTE 9 + Hardener 61 | SHIMOKOTE 9 + Hardener 43 |
|---|---|---|
| Room Temp Cure | 24 h at RT | 12-16 h at RT + 4-6 h at 80-100°C |
| Alternative Cure | 1-2 h at 60-65°C + 12 h at RT | 48-72 h at RT |
| Full Cure at RT | 7 days | 7 days |
| Property | SHIMOKOTE 9 + Hardener 61 | SHIMOKOTE 9 + Hardener 43 |
|---|---|---|
| Tensile Strength (ISO 527) | 40 MPa | 26 MPa |
| Compressive Strength (ISO 604) | 110 MPa | 90 MPa |
| Flexural Strength (ISO 178) | 48 MPa | 42.5 MPa |
| Water Absorption (ISO 62) | 0.45% | 0.42% |
| Heat Distortion Temp. (DIN 53458) | 62°C | 48°C |
| Thermal Conductivity (ASTM C 518) | NT | 0.496 W/mK |
| Hardness (ISO 868, Shore D) | 85 ± 10 | 80 ± 10 |
| Density of Cured Mass (IEC 60455) | 1.55 ± 0.1 g/cm³ | 1.54 ± 0.1 g/cm³ |
| Glass Transition Temperature (ASTM D 3418) | NT | 40 – 50°C |
| Linear Thermal Expansion (ASTM E 831) | NT | Below Tg: 60 – 90 x 10⁻⁶ /°C, Above Tg: 140 – 200 x 10⁻⁶ /°C |
| Property | SHIMOKOTE 9 + Hardener 61 | SHIMOKOTE 9 + Hardener 43 |
|---|---|---|
| Dielectric Strength (IEC 60243, 3mm at RT) | 18 kV/mm | 17 kV/mm |
| Volume Resistivity (IEC 60455-2, at RT) | 10¹⁵ ohm.cm | 10¹⁵ ohm.cm |
| Dielectric Constant (IEC 60455-2, 30V/1kHz, at RT) | NT | NT |
| Dielectric Loss Factor (IEC 60455-2, 30V/1kHz, at RT) | 0.022 | 0.022 |
| Track Resistance (IEC 60112, at RT) | >600V | >600V |
| Chemical | Effect |
|---|---|
| 25% H₂SO₄ | No change in color |
| 5% NaOH | No change in color |
Stronger Bonding. Cleaner Process. Reliable Performance. If you are looking for an adhesive that combines high adhesion strength, flexibility, and electronic safety, 3320-80 is the
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
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