TSE3281-G is a one-component, heat-curable silicone adhesive designed for thermally conductive bonding applications. It provides good thermal conductivity (1.68 W/m·K), excellent adhesion, and low shrinkage, making it suitable for bonding, sealing, and gap-filling in electronic assemblies.

This material cures rapidly with heat and forms an elastomer with excellent dielectric properties and non-corrosive characteristics. It adheres well to a variety of substrates without requiring a primer, ensuring reliable performance in power electronics, LEDs, and semiconductor applications.

Key Features & Benefits

✅ Good Thermal Conductivity (1.68 W/m·K) – Ensures efficient heat dissipation.
✅ One-Component, Ready-to-Use – No mixing required, simplifying application and processing.
✅ Primerless Adhesion – Bonds well to various substrates, including metals and ceramics.
✅ Fast Heat-Curing – Accelerates production cycles (cures in 1 hour at 150°C).
✅ Non-Corrosive to Metals – Ensures long-term stability in sensitive applications.
✅ Low Shrinkage & No Cure By-Products – Suitable for deep-section applications and enclosed assemblies.

Potential Applications

📌 Thermally Conductive Bonding & Sealing – Ideal for heat sinks, power electronics, and semiconductor packaging.
📌 LED & Lighting Applications – Enhances thermal management for high-power LED modules.
📌 Battery & Automotive Electronics – Used in EV battery modules, control units, and power converters.
📌 RF & Microwave Electronics – Ensures heat dissipation in high-frequency applications.