TSE3062 is a two-component, low viscosity silicone gel designed for electronics potting applications. This product cures at room temperature to a soft, tacky gel with the addition of curing agent. The cure time can be accelerated with heat. The soft nature and cushioning effect of this product provides excellent protection for electronic assemblies from external humidity, mechanical shock and vibration.

Key Features

• Convenient 1:1 mix ratio by weight
• Low viscosity – easily pourable
• Room temperature curable and heat accelerated cure
• Soft, tacky gel
• Absorbs shock and protects delicate mechanical components from vibration
• No reactive by-products; non corrosive
• Excellent electrical properties
• Excellent resistance to temperature extremes

Applications

• Electrical and electronic potting such as hybrid IC and power module
• Potting of high voltage parts