Applications

LOCTITE ABLESTIK 8700K

  • Item Name: LOCTITE ABLESTIK 8700K
  • Manufacturer: Henkel
  • Product Category: Epoxy Adhesive
  • Technologies: Epoxy, Non-conductive, Heat Cure
  • Applications: Die attach, Hybrid components, Gold substrate bonding
  • Color: White
  • Cure Type: Heat cure (1 hour @ 175°C or 2 hours @ 160°C)
  • Package Size: Contact Avantek for details.
  • Shelf Life: 12 months (at -40°C)

1. Product Overview

LOCTITE ABLESTIK 8700K is a non-conductive, heat-cured epoxy adhesive designed for die attach applications. It provides excellent adhesion to thin film and thick film gold surfaces and retains its dispensed height after curing without slumping. The product meets MIL-STD-883, Method 5011 requirements.

2. Applications

  • Die attach applications
  • Suitable for hybrid components
  • Excellent adhesion to gold substrates

3. Typical Properties

Uncured Properties

Property Value
Technology Epoxy
Appearance White
Cure Type Heat Cure
Viscosity (@ 25°C) 45,000 mPa·s (cP)
Work Life (@ 25°C) 30 days
Shelf Life (@ -40°C) 365 days

Curing Properties

Cure Schedule Condition
Standard Cure 1 hour @ 175°C
Alternative Cure 2 hours @ 160°C

Cured Properties

Physical Properties

Property Value
Coefficient of Thermal Expansion (CTE) Below Tg: 20 ppm/°C
Above Tg: 55 ppm/°C
Glass Transition Temperature (Tg) 165°C
Thermal Conductivity (@ 121°C) 0.5 W/(m-K)
Weight Loss (@ 300°C) 0.35%
Moisture Absorption (@ 85°C/85% RH) 1.98%

Electrical Properties

Property Value
Volume Resistivity 3 × 10¹⁴ ohm-cm

Adhesion Properties

Property Condition Value
Die Shear Strength 2 × 2 mm gold substrate, @ 25°C 30 kg-f

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