LOCTITE ABLESTIK 8301 is a silver-filled, electrically conductive die attach adhesive designed for high-reliability package applications. It features snap cure, low stress, high reliability, and hot/wet die shear strength, making it ideal for a wide range of package sizes. The adhesive also offers improved JEDEC performance and is compatible with PPF, bare copper, and silver substrates.
| Property | Value |
|---|---|
| Technology | Epoxy Hybrid |
| Appearance | Silver |
| Filler Type | Silver |
| Cure | Heat Cure |
| Thixotropic Index (0.5/5 rpm) | 4.8 |
| Viscosity (Brookfield CP51, 25°C, 5 rpm) | 10,000 mPa·s (cP) |
| Work Life (@ 25°C) | 24 hours |
| Shelf Life (@ -40°C) | 365 days |
| Zone | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 |
|---|---|---|---|---|---|---|---|---|
| Temperature (°C) | 150 | 150 | 170 | 170 | 190 | 190 | 240 | 240 |
| Time (seconds) | 60 |
Physical Properties
| Property | Value |
|---|---|
| Chloride (Cl⁻) | <10 ppm |
| Sodium (Na⁺) | <10 ppm |
| Potassium (K⁺) | 5 ppm |
| Tensile Modulus | @ -65°C: 6,300 N/mm² (913,700 psi) @ 25°C: 540 N/mm² (78,800 psi) @ 150°C: 170 N/mm² (24,100 psi) @ 200°C: 70 N/mm² (9,400 psi) @ 250°C: 60 N/mm² (8,700 psi) |
Electrical Properties
| Property | Value |
|---|---|
| Volume Resistivity | 0.0001 ohm-cm |
Performance Properties
| Test | Condition | Result |
|---|---|---|
| Die Shear Strength (2×2 mm Si die) | @ 25°C (Bare Cu leadframe) | 2 kg-f |
| Die Shear Strength (7.6×7.6 mm Si die) | @ 240°C (Cu leadframe) | 15 kg-f |
| Chip Warpage (Post Mold Bake 4h @175°C) | 7.6×7.6 mm chip | 15 µm |
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Avantek Viet Nam is a dynamic MRO, direct materials and equipment supplier that brings advanced technological solutions to maximize satisfaction of customers.
We are expert in import and export of adhesives, accessories and equipment in both domestic and cosmetic industrial fields, production and technology research and development.
Our solutions promise to bring best optimal effectiveness along with competitive prices, excellent customer services, dedicated on-site support.
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