SilCool TIA241GF gap filler is a 2-component, soft, thermally conductive silicone material used to dissipate heat from electronic devices. Its non-slumping pasty consistency offers physical stability that can allow improved processing. SilCool TIA241GF gap filler can be used as a liquid dispensed alternative to pre-fabricated thermal pads in a broad array of thermal designs for electronic applications.
Key Features
Applications
Thermal interface for electronic components in Automotive, Consumer, Telecommunication, Lighting and Industrial applications.
| Đặc điểm | SilCool TIA241GF (A) | SilCool TIA241 GF (B) |
| Màu (thành phần A & thành phần B) | xanh | xanh nhạt |
| Độ nhớt *1 Pa•s | 250 | 130 |
| Tỷ lệ trộn theo trọng lượng | 1:1 | 1:1 |
| Độ nhớt sau khi trộn Pa•s | 130 | 130 |
| Chỉ số lưu biến | 2.6 | 2.6 |
| Thời gian thao tác ở 23°C (giờ) | 3 | 3 |
| Điều kiện khô (giờ) at 100 °C at 70 °C at 23 °C |
0.25 0.50 24 |
0.25 0.50 24 |
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