FX219G5 – Silicone Potting & Encapsulation Compound
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
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Brand: Insulcast
Package Sizes: Contact us for details
Shelf Life: 12 months
Insulcast RTVS 3-95-2 is a highly thermally conductive, high-temperature RTV silicone compound that meets the flammability requirements of UL 94V-0. It is formulated for potting and encapsulation applications, providing excellent thermal conductivity, high dielectric strength, and a broad service temperature range (-55°C to +260°C).
✅ High Thermal Conductivity: 1.44 W/m·K for superior heat dissipation.
✅ UL 94V-0 Flame Retardant: Enhances fire safety.
✅ High-Temperature Stability: Operates between -55°C to +260°C.
✅ Good Electrical Insulation Properties: High dielectric strength and volume resistivity.
✅ Durable & Flexible: Provides strong mechanical properties.
🔹 Electronic Potting & Encapsulation: Protects PCBs, transformers, and other sensitive components.
🔹 Industrial & Automotive Electronics: Suitable for harsh environments with high heat exposure.
🔹 Aerospace & Defense Applications: Used in high-performance electronic systems.
🔹 Thermal Management Systems: Ensures efficient heat transfer in power electronics.
| Property | Part A | Part B | Mixed | Test Standard |
|---|---|---|---|---|
| Color | Red | White | – | Visual |
| Viscosity (cP) | 35,000 | 35,000 | 35,000 | ASTM D2393 |
| Specific Gravity | 2.36 | 2.27 | – | – |
| Mix Ratio (by Weight/Volume) | 1:1 | – | – | – |
| Pot Life (100g mass) | 1.5 hours | – | – | – |
| Gel Time (25°C) | 2-4 hours | – | – | – |
| Property | Value | Test Standard |
|---|---|---|
| Hardness (Shore A) | 85 | ASTM D2240 |
| Tensile Strength (psi / MPa) | 400 / 2.9 | ASTM D412 |
| Tensile Elongation (%) | 17 | ASTM D412 |
| Tear Strength (N/mm) | 0.9 | ASTM D624 |
| Thermal Conductivity (W/m·K) | 1.44 | ASTM D5470 |
| Coefficient of Thermal Expansion (°C⁻¹) | 15 × 10⁻⁵ | – |
| Service Temperature Range (°C) | -55 to +260 | – |
| Property | Value | Test Standard |
|---|---|---|
| Dielectric Strength (V/mil) | 425 | ASTM D149 |
| Dielectric Constant (1 kHz) | 5.0 | ASTM D150 |
| Dissipation Factor (1 kHz) | 0.005 | ASTM D150 |
| Volume Resistivity (ohm-cm) @ 25°C | 1 × 10¹⁴ | ASTM D257 |
| Volume Resistivity (ohm-cm) @ 125°C | 1 × 10¹³ | ASTM D257 |
| Cure Method | Time & Temperature |
|---|---|
| Room Temperature Cure | 24 hours at 25°C (77°F) |
| Accelerated Cure | 2-4 hours at 65°C (149°F) |
| Rapid Cure | 1 hour at 90°C (194°F) |
| High-Speed Cure | 15 minutes at 125°C (257°F) |
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
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