Applications

DOWSIL™ TC-5622 Thermally Conductive Compound

  • Technology: Thermally conductive silicone compound
  • Brand Name: DOWSIL™ TC-5622 Thermally Conductive Compound
  • Manufacturer: Dow Chemical Company
  • Package Size: Contact Avantek for details.
  • Shelf Life: Contact Avantek for details.

1. Product Overview

DOWSIL™ TC-5622 is a gray, flowable, non-curing thermally conductive compound designed for efficient heat transfer. It is a solventless, polydimethylsiloxane-based material with high thermal conductivity, good stability, and reliability.

2. Applications

  • Cooling of electronic modules, including computer MPUs and power modules
  • PCB system assemblies requiring thermal management
  • Bonding heat-generating components to heat sinks or chassis

3. Typical Properties

Before Application (Uncured State)

Property Unit Value
Appearance Gray
Composition Filled polydimethylsiloxane
Viscosity cP (Pa·s) 95,000 (95)
Specific Gravity 2.5
Thermal Conductivity W/m·K 4.3
Thermal Resistance (25 N/cm²) °C·cm²/W 0.06
Bond Line Thickness inch (mm) 0.0008 (0.02)

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