Applications

DOWSIL™ TC-5622 Thermally Conductive Compound

  • Technology: Thermally conductive silicone compound
  • Brand Name: DOWSIL™ TC-5622 Thermally Conductive Compound
  • Manufacturer: Dow Chemical Company
  • Package Size: Contact Avantek for details.
  • Shelf Life: Contact Avantek for details.

1. Product Overview

DOWSIL™ TC-5622 is a gray, flowable, non-curing thermally conductive compound designed for efficient heat transfer. It is a solventless, polydimethylsiloxane-based material with high thermal conductivity, good stability, and reliability.

2. Applications

  • Cooling of electronic modules, including computer MPUs and power modules
  • PCB system assemblies requiring thermal management
  • Bonding heat-generating components to heat sinks or chassis

3. Typical Properties

Before Application (Uncured State)

Property Unit Value
Appearance – Gray
Composition – Filled polydimethylsiloxane
Viscosity cP (Pa·s) 95,000 (95)
Specific Gravity – 2.5
Thermal Conductivity W/m·K 4.3
Thermal Resistance (25 N/cm²) °C·cm²/W 0.06
Bond Line Thickness inch (mm) 0.0008 (0.02)

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