Applications

DOWSIL™ SE 4402 Thermally Conductive Adhesive

Technology: Thermally Conductive Silicone Adhesive
Brand Name: DOWSIL™ SE 4402 Thermally Conductive Adhesive
Manufacturer: Dow Chemical Company
Package size: Contact Avantek for details.
Shelf life: Contact Avantek for details.

1. Product Overview

DOWSIL™ SE 4402 is a one-part, gray, flowable thermally conductive adhesive. It is designed to provide strong adhesion and efficient heat dissipation for electronic and automotive applications.

Key Features & Benefits:

  • One-part formulation – no mixing required
  • Long working time
  • Heat curable for fast processing
  • Flowable consistency for ease of application
  • Excellent adhesion to various substrates
  • Thermally conductive, aiding in heat dissipation

Composition:

  • Thermally conductive filler
  • Polydimethylsiloxane adhesive

2. Applications

DOWSIL™ SE 4402 is designed for long-term bonding and efficient thermal management in electronic assemblies.

Common Uses:

  • Bonding organic and ceramic substrates to heat sinks
  • Thermal management for control modules in automotive applications
  • PCB system assemblies where heat dissipation is critical

3. Typical Properties

Property Unit Result
Before Curing
Color Gray
Fluidity mm 65
Viscosity cP (mPa·s) 32,000
Specific Gravity 2.2
Heat Cure Time at 150°C minutes 30
After Curing
Durometer Hardness Shore A 75
Tensile Strength psi (MPa) 800 (5.5)
Elongation % 115
Unprimed Adhesion (Lap Shear, Al) psi (MPa) 530 (3.65)
Dielectric Constant (1 MHz) 4.8
Dissipation Factor (1 MHz) 0.003
Dielectric Strength volts/mil (kV/mm) 625 (25)
Volume Resistivity ohm-cm 3E+15
Thermal Conductivity btu/hr-ft-°F (W/mK) 0.52 (0.9)
Curing Process
Recommended Cure Temp °C 100+
Pre-cure for Thick Sections minutes @ 70°C 30
Usable Temperature Range °C -45 to 200

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