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DOWSIL™ TC-4026 Dispensable Thermal Pad – Thermal Pad – Automotive, LED, and Consumer Applications

  • Item Name: DOWSIL™ TC-4026 Dispensable Thermal Pad
  • Manufacturer: Dow Chemical Company
  • Technologies: Two-part polydimethylsiloxane-based thermally conductive dispensable pad
  • Color: Part A – White to Off-White, Part B – Blue, Mixed – Blue
  • Cure Type: Room temperature cure with heat acceleration option
  • Package Size: Contact to Avantek for details.
  • Shelf Life: Contact to Avantek for details.

1. Product Overview

DOWSIL™ TC-4026 Dispensable Thermal Pad is a two-part, 1:1 mix ratio, thermally conductive silicone material designed for easy application via dispensing or screen printing. It serves as a flexible alternative to traditional fabricated pads, offering excellent thermal performance, stress relief, shock dampening, and reworkability. The product maintains its thickness after application and cure and provides a cost-effective solution for managing heat in electronic and automotive applications. It operates in a wide temperature range from -45°C to 200°C.

2. Applications

  • Thermal interface material for cooling PCB system assemblies in LED lighting, automotive, and consumer electronics.
  • Can be screen-printed or dispensed into various shapes, offering more design flexibility compared to traditional pads.
  • Ideal for applications requiring low thermal resistance, high thermal conductivity, and adaptable bond line thicknesses (BLTs).
  • Supports automated dispensing, stencil printing, and screen printing for efficient application.

3. Typical Properties

Before Mixing (Uncured Components)

Property Unit Part A Part B Mixed
Appearance White to Off-White Blue Blue
Viscosity cP 73,000 74,000 70,000
Mix Ratio 1:1 1:1 1:1
Working Time (Pot Life) at 25°C Hours 4

After Mixing (Cured Properties)

Property Unit Result
Cure Time at 25°C Hours 24
Cure Time at 40°C Minutes 145
Cure Time at 75°C Minutes 40
Cure Time at 100°C Minutes 15
Cure Time at 125°C Minutes 10
Hardness (Shore 00) 50
Thermal Conductivity W/m·K 2.5
Volume Resistivity Ohm·cm 3.9E+12
Tensile Strength psi 24
Elongation % 200
Dielectric Strength kV/mm 18
Dielectric Constant (100 Hz) 6.7
Dielectric Constant (1 MHz) 6.4
Flammability Rating (UL-94) V-0
RTI Rating °C 150

This dispensable thermal pad is an effective solution for improving thermal management in high-performance PCB system assemblies while providing flexibility, reliability, and automation compatibility.

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