Brand: Bostik
Product Number: Thermelt 865 Natural
Technology: Polyamide Hot Melt Resin
Color: Natural
Cure Type: Low-Pressure Molding
Package Size: 20Kg bag (pellets)
Shelf Life: 12 months
Bostik Thermelt 865 Natural is a pure copolymer polyamide hot melt resin designed for low-pressure molding applications. It is a non-reactive, solvent-free adhesive with good flexibility, impact resistance, and moderate flame retardancy (UL94 V-2, UL file E116659). It is mainly used for molding electronic/electric components, connectors, and cables.
| Property | Value | Standard Test |
|---|---|---|
| Viscosity (210°C, SC4, 50 RPM) | 2.5–3.5 Pa.s | ASTM D3236 |
| Softening Point | 149–165°C | ASTM D3461 |
| Water Content | <0.2% | Bostik Internal Test |
| Commercial Shape | Pellets | — |
| Property | Value | Standard Test |
|---|---|---|
| Yield Strength (50 mm/min, 23°C) | >2.8 MPa | ISO 527 |
| Strength at Break (50 mm/min, 23°C) | 3.0 MPa | ISO 527 |
| Young’s Modulus (50 mm/min, 23°C) | 32 MPa | ISO 527 |
| Elongation at Break (50 mm/min, 23°C) | >200% | ISO 527 |
| Property | Value | Standard Test |
|---|---|---|
| Vicat Softening Temperature (A120) | 31°C | ISO 306 |
| Glass Transition Temperature | -50°C | Bostik Internal Test |
| Property | Value | Standard Test |
|---|---|---|
| Transversal Resistivity (500V) | 2.8 × 10¹¹ Ω·cm | IEC 60093 |
| Dielectric Rigidity (23°C) | 18 kV/mm | IEC 60243-1 |
| Relative Permittivity (50Hz, 23°C) | 5.7 F/m | IEC 60250 |
| Property | Value | Standard Test |
|---|---|---|
| Density | ~1 | Internal Test |
| Water Absorption (Immersed, 23°C) | 3.0% | ISO 62 |
| Hardness (Shore D, 23°C) | 31 | ISO 868 |
| Parameter | Value |
|---|---|
| Melt Temperature Range | 190–210°C |
| Mold Temperature Range | 20–60°C |
| Drying Time (Air Oven, Thin Layer) | 8 hours |
| Drying Temperature | 70°C |
| Processing Moisture Content | <0.2% |
Stronger Bonding. Cleaner Process. Reliable Performance. If you are looking for an adhesive that combines high adhesion strength, flexibility, and electronic safety, 3320-80 is the
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
As the year draws to a close and the Christmas season arrives, Avantek Viet Nam would like to extend our warmest Christmas greetings to all our valued customers, partners, and friends.
Avantek Viet Nam is a dynamic MRO, direct materials and equipment supplier that brings advanced technological solutions to maximize satisfaction of customers.
We are expert in import and export of adhesives, accessories and equipment in both domestic and cosmetic industrial fields, production and technology research and development.
Our solutions promise to bring best optimal effectiveness along with competitive prices, excellent customer services, dedicated on-site support.
Office address: The Verosa Park, 39 street 10, Quarter 2, Long truong Ward, Ho Chi Minh City, Viet Nam
Website: avantek.vn
Email 1: info@avantek.vn
Email 2: long.pham@avantek.vn
Tel: (+84) 944 415 762
Copyright © AVANTEK VN CO., LTD
Leave your information or contact via Hotline, our Customer Support Technical team will contact you immediately!
