Brand: Bostik
Product Number: Thermelt 861 HV Black
Technology: Polyamide Hot Melt Resin
Color: Black
Cure Type: Low-Pressure Molding
Package Size: Pellets
Shelf Life: 18 months
Bostik Thermelt 861 HV Black is a pure copolymer polyamide hot melt resin developed for low-pressure molding applications. It is non-reactive, solvent-free, and designed for encapsulation of electronic and electrical components. This adhesive provides high flexibility, toughness, and excellent dielectric strength, ensuring protection against mechanical stress and environmental exposure. It complies with RoHS regulations and contains no phthalates.
| Property | Value | Standard Test |
|---|---|---|
| Viscosity (200°C, SC4, 10 RPM) | 10.0–14.0 Pa.s | ASTM D3236 |
| Softening Point | 155–166°C | ASTM D3461 |
| Commercial Shape | Pellets | — |
| Property | Value | Standard Test |
|---|---|---|
| Yield Strength (50 mm/min, dry) | 4.1 MPa | ISO 527 |
| Maximum Tensile Strength (50 mm/min, dry) | 5.4 MPa | ISO 527 |
| Young’s Modulus (50 mm/min, dry) | 31 MPa | — |
| Elongation at Break (50 mm/min, dry) | 500% | ISO 527 |
| Property | Value | Standard Test |
|---|---|---|
| Dielectric Strength | IEC 60243-1 | |
| Volume Resistivity | IEC 60093 | |
| Comparative Tracking Index (CTI) | IEC 60112 |
| Property | Value | Standard Test |
|---|---|---|
| Molding Shrinkage (Normal, Parallel) | — | ISO 294-4 |
| HDT (0.45 MPa) | — | ISO 75-1/-2 |
| Vicat Softening Temperature (A120) | 36°C | ISO 306 |
| Glass Transition Temperature | -30°C | ISO 11357-2 |
| Property | Value | Standard Test |
|---|---|---|
| Hardness (Shore D) | 22 | ISO 868 |
| Density | 0.98 | ISO 1183 |
| Water Absorption (Saturation, 23°C) | 2.8% | ISO 62 |
| Glow Wire Flammability Index (GWFI) | — | — |
| Glow Wire Ignition Temperature (GWIT) | — | — |
| Flammability (UL94) | V-0 (In progress) | UL file E116659 |
| Parameter | Value |
|---|---|
| Melt Temperature Range | 210–230°C |
| Mold Temperature Range | 20–60°C |
| Drying Time (Dehumidified Dryer) | 4–6 hours |
| Drying Temperature | 70°C |
| Processing Moisture Content | <0.2% |
Stronger Bonding. Cleaner Process. Reliable Performance. If you are looking for an adhesive that combines high adhesion strength, flexibility, and electronic safety, 3320-80 is the
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
As the year draws to a close and the Christmas season arrives, Avantek Viet Nam would like to extend our warmest Christmas greetings to all our valued customers, partners, and friends.
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