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BERGQUIST BOND PLY TBP 720LMS – Laminating Adhesive – Thermal Management & Electronics

  • Item Name: BERGQUIST BOND PLY TBP 720LMS
  • Manufacturer: Henkel
  • Technologies: Heat-cured, low modulus silicone laminating adhesive on fiberglass weave
  • Color: Light brown
  • Cure Type: Heat cured
  • Package Size: Contact to Avantek for details.
  • Shelf Life: 3 months

1. Product Overview

BERGQUIST BOND PLY TBP 720LMS is a thermally conductive, fiber-reinforced, heat-curable laminating adhesive film. It consists of a low modulus silicone compound coated on a fiberglass weave with protective liners. This adhesive provides excellent thermal performance, long-term integrity, and absorbs mechanical stress caused by CTE mismatch, shock, and vibration.

2. Applications

  • Used for thermal management in electronic applications.
  • Fastening power components and PCBs to heat sinks.
  • Suitable for bonding metal-to-metal and metal-to-FR4 PCB assemblies.

3. Typical Properties

Physical Properties

Property Test Method Value
Tensile Strength (post-cured) ASTM D412 1,400 psi

Adhesion Properties

Property Test Method Value
Lap Shear Strength (Anodized Alum) RD 3015 300 psi

Electrical Properties

Property Test Method Value
Dielectric Breakdown Voltage (post-cured) ASTM D149 7.5 kVAC

Thermal Properties

Property Test Method Value
Thermal Conductivity (post-cured) ASTM D5470 0.72 W/m-K
TO-220 Thermal Performance (20-75 psi) RD 2010 2.4°C/W

4. Storage and Handling

  • Store at 10°C for a 90-day shelf life.
  • Short-term exposure to room temperature (≤1 week) does not affect performance.

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