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BERGQUIST BOND PLY TBP 1400LMS-HD

-Item Name: BERGQUIST BOND PLY TBP 1400LMS-HD
-Manufacturer: Henkel
-Technologies: Silicone
-Color: Yellow
-Cure Type: Heat cure
-Package Size: Contact to Avantek for details.
-Shelf Life: 5 months

1. Product Overview

BERGQUIST BOND PLY TBP 1400LMS-HD is a thermally conductive, heat-curable laminate material consisting of a high-performance, low modulus silicone compound coated on a cured core. It features:

  • Technology: Silicone-based, fiberglass-reinforced
  • Total Thickness: 0.254 – 0.457 mm
  • Operating Temperature Range: -60 to 180°C
  • Key Benefits:
    • Exceptional dielectric strength
    • Low interfacial resistance
    • 200 psi adhesion strength
    • Eliminates mechanical fasteners
    • TO-220 thermal performance: 2.3°C/W

2. Applications

  • Bonding discrete semiconductor packages to heat spreaders or heat sinks
  • Structural adhesion of power components and PCBs to heat sinks
  • Ideal for applications requiring mechanical stress absorption and long-term thermal integrity

3. Typical Properties

Property Value Test Method
Physical Properties
Flammability Rating UL 94 V-0 UL 94
Adhesion Properties
Lap Shear Strength @ 25°C 1.4 MPa (200 psi) ASTM D1002
Electrical Properties
Dielectric Breakdown Voltage (Sheet) 5,000 Vac ASTM D149
Dielectric Breakdown Voltage (Laminated) 4,000 Vac ASTM D149
Dielectric Constant @ 1,000 Hz 5.0 ASTM D150
Volume Resistivity 1×10¹¹ ohm-meter ASTM D257
Thermal Properties
Thermal Conductivity 1.4 W/(m·K) ASTM D5470
TO-220 Thermal Performance 2.1°C/W (constant pressure), 2.3°C/W (initial pressure only) RD 2010

4. Shelf Life & Cure Schedule

  • Storage Conditions: 5-25°C, shelf life of 5 months
  • Cure Schedule:
    • 30 min @ 125°C (ASTM D4473)
    • 6 min @ 160°C (ASTM D4473)

5. Configurations Available

  • Roll form
  • Sheet form
  • Die-cut parts

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