FX219G5 – Silicone Potting & Encapsulation Compound
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
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Brands: Scotch-Weld™
Package Sizes:
Shelf Life: 12 months
3M™ Scotch-Weld™ Low Odor Acrylic Adhesive DP8710NS is a black, non-sag, low-odor, two-part structural acrylic adhesive with a non-flammable classification. It is designed for bonding a variety of substrates, including metals, plastics, composites, and painted surfaces, with minimal surface preparation. This adhesive offers a 10-minute work life and achieves handling strength in approximately 12-14 minutes. It provides excellent impact strength, peel resistance, flexibility, and maintains structural strength at temperatures as low as -40°C (-40°F). The formulation includes spacer beads to control bond line thickness and has a reduced toxicological hazard profile, enhancing workplace safety.
| Attribute | Value |
|---|---|
| Color | Black |
| Mix Ratio by Volume (B:A) | 10:1 |
| Mix Ratio by Weight (B:A) | 10:1 |
| Base Viscosity | 15,000 – 80,000 cP¹ |
| Accelerator Viscosity | 5,000 – 20,000 cP¹ |
| Base Density | 1.07 g/cm³ |
| Accelerator Density | 1.0 g/cm³ |
¹ Viscosity measured using cone-and-plate viscometer; reported viscosity at 4 sec⁻¹ shear rate.
| Attribute | Value |
|---|---|
| Density (mixed) | 1.0 g/cm³ |
| Viscosity (mixed) | 40,000 cP |
| Work Life | 8 – 10 minutes¹ |
| Open Time | 10 – 12 minutes² |
| Set Time | 12 – 14 minutes³ |
| Time to Structural Strength | 15 – 20 minutes⁴ |
| Time to Full Cure | 24 hours at 23°C (73°F) |
¹ Maximum time adhesive can remain in a static mixing nozzle and still be expelled without undue force.
² Maximum time allowed after applying adhesive to a substrate before bond must be closed and fixed.
³ Minimum time required to achieve 0.3 MPa (50 psi) of overlap shear strength.
⁴ Minimum time required to achieve 6.9 MPa (1,000 psi) of overlap shear strength.
| Attribute | Test Method | Value |
|---|---|---|
| Modulus | ASTM D638, ISO 527 | 44.2 MPa (6,410 psi)¹ |
| Tensile Strain at Break | ASTM D638, ISO 527 | 113%² |
| Shore D Hardness | ASTM D2240 | 65 |
¹ 3 mm (1/8 in) thick Type I test specimens; samples pulled at 5 mm/min (0.2 in/min). 2-week dwell at 22°C (72°F).
² 3 mm (1/8 in) thick Type I test specimens; samples pulled at 5 mm/min (0.2 in/min).
Overlap Shear Strength
| Substrate | Surface Preparation | Test Temperature | Dwell Time | Strength¹ |
|---|---|---|---|---|
| Aluminum | MEK/Abrade/MEK | 23°C (73°F) | 7 days | 14.5 MPa (2,101 psi) |
| Cold Rolled Steel | MEK/Abrade/MEK | 23°C (73°F) | 7 days | 14.0 MPa (2,031 psi) |
| ABS | Light Abrasion and Solvent Clean | 23°C (73°F) | 24 hours | 5.8 MPa (846 psi) |
| Acrylic (PMMA) | Light Abrasion and Solvent Clean | 23°C (73°F) | 24 hours | 4.0 MPa (582 psi) |
| Epoxy Resin (Fiber-Reinforced) | Light Abrasion and Solvent Clean | 23°C (73°F) | 24 hours | 13.4 MPa (1 |
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
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