FX219G5 – Silicone Potting & Encapsulation Compound
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
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Brand: 3M™ Scotch-Weld™
Product Number: 2214 Hi-Dense
Technologies: Epoxy
Color: Gray
Cure Type: Heat Cure
Package Sizes: 6 fl oz
Shelf Life: 12 months
3M™ Scotch-Weld™ Epoxy Adhesive 2214 Hi-Dense is a paste consistency epoxy adhesive, one-part, 100% solids, heat-curing epoxy designed for structural bonding applications requiring a void-free, high-density bondline. This adhesive is a deaerated version of 3M™ Scotch-Weld™ Epoxy Adhesive 2214 Regular, ensuring exceptional adhesion without air pockets. It is specifically formulated for bonding metals and high-temperature plastics, such as fiberglass-reinforced plastic, polyester, and phenolics. Additionally, it is UL 94 HB rated, making it suitable for applications requiring flame resistance.
| Attribute Name | Value |
|---|---|
| Color | Gray¹ |
| Viscosity | >1,000,000 cP² |
| Viscosity (Flow Rate) | 60 – 200 s³ |
| Net Weight | 12.6 lb/gal |
| Base | Modified Epoxy |
¹ Colors may vary from nearly white to yellow/amber; performance is not affected.
² Due to its thixotropic paste nature, Brookfield viscosity is over 1,000,000 cP.
³ Time required to deliver 20 g at 345 kPa (50 psi) through a 2.5 mm (0.10 in) orifice.
| Attribute Name | Value |
|---|---|
| Time to Full Cure | 40 minutes |
| Attribute Name | Value |
|---|---|
| Cured Color | Gray |
| Modulus | 750,000 lb/in² |
| Shore D Hardness (ASTM D2240) | 85 |
| Attribute Name | Test Method | Value |
|---|---|---|
| Overlap Shear Strength (Cold Rolled Steel, MEK/Abrade/MEK, 7 Days Dwell Time) | ASTM D1002, ISO 4587 | 2,500 lb/in²¹ |
| T-Peel Adhesion (Aluminum, 23°C / 73°F) | ASTM D1876 | 5 lb/in width² |
| T-Peel Adhesion (Steel, MEK Wipe, 23°C / 73°F) | ASTM D1876 | 50 lb/in width² |
| Elongation at Break | – | <2% |
| Tensile Strength at Break | – | 10,000 lb/in² |
¹ 25 mm (1″) wide, 12.7 mm (1/2″) overlap samples, bondline thickness: 0.13-0.20 mm (5-8 mil).
² Measured using etched 2024-T3 clad aluminum panels, tested at 508 mm/min (20 in/min) separation rate.
| Attribute Name | Test Condition | Value |
|---|---|---|
| Coefficient of Thermal Expansion | 0 ~ 80°C | 49 x 10⁻⁶ m/m/°C |
| Thermal Conductivity | – | 0.231 (btu-ft)/(h-ft²-°F) |
| Arc Resistance | ASTM D495 | 76 seconds |
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
As the year draws to a close and the Christmas season arrives, Avantek Viet Nam would like to extend our warmest Christmas greetings to all our valued customers, partners, and friends.
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