SilCool™ TIA350R is a one-component, heat-curable silicone adhesive developed for thermally conductive applications. It is engineered to cure rapidly when exposed to heat and provides excellent thermal management and reliable electrical insulation. TIA350R adheres well to a broad range of substrates without the need for a primer and is designed for efficient bonding between heat sources and heat sinks, such as in power modules or electronic devices.

Key Features and Benefits:

• High thermal conductivity (3.5 W/m·K)

• Fast cure at low temperature (30 min @ 120 °C)

• One-component, no mixing required

• Electrically insulating

• Primerless adhesion to many substrates

• Non-corrosive to metals

Potential Applications:

• Bonding thermal interface between dies and heat spreaders

• Adhesive layer between heat sources and heat sinks, modules, or chassis