Applications

Bostik Thermelt 867 Natural Polyamide Hot Melt Resin

Brand: Bostik
Product Number: Thermelt 867 Natural
Technology: Polyamide Hot Melt Resin
Color: Natural
Cure Type: Low-Pressure Molding
Package Size: 20Kg bag (pellets)
Shelf Life: 18 months

Product Description

Bostik Thermelt 867 Natural is a pure copolymer polyamide hot melt resin, specially designed for low-pressure molding applications. It is non-reactive, solvent-free, and offers high-performance molding for electronic/electrical components, connectors, and cables. This adhesive exhibits excellent toughness, flexibility, and thermal resistance, making it ideal for automotive applications. It is UL94 V-0 flame retardant certified (UL file E116659).

Key Features

  • Designed for low-pressure molding applications
  • Mainly used in automotive applications
  • Flame retardant (UL94 V-0 certified)
  • High flexibility and impact resistance
  • Solvent-free and moisture-resistant formulation

Recommended Applications

  • Encapsulation of electronic/electric components
  • Molding of connectors and cables
  • Automotive applications requiring flame retardancy

Technical Data

Physical Properties
Property Value Standard Test
Viscosity (220°C, SC4, 50 RPM) 3.0–4.0 Pa.s ASTM D3236
Softening Point 175–190°C ASTM D3461
Water Content <0.2% Bostik Internal Test
Commercial Shape Pellets
Mechanical Properties
Property Value Standard Test
Yield Strength (50 mm/min, 23°C) >2.8 MPa ISO 527
Strength at Break (50 mm/min, 23°C) 6.1 MPa ISO 527
Young’s Modulus (50 mm/min, 23°C) 83 MPa ISO 527
Elongation at Break (50 mm/min, 23°C) >200% ISO 527
Thermal Properties
Property Value Standard Test
Vicat Softening Temperature (A120) 63°C ISO 306
Glass Transition Temperature (DSC) -50°C Bostik Internal Test
Glow Wire Flammability Index (GWFI) 960°C UL746A
Glow Wire Ignition Temperature (GWIT) 750°C UL746A
Electrical Properties
Property Value Standard Test
Transversal Resistivity (500V) 2.9 × 10¹² Ω·cm IEC 60093
Dielectric Rigidity (23°C) 20 kV/mm IEC 60243-1
Relative Permittivity (50Hz, 23°C) 5.6 F/m IEC 60250
Miscellaneous Properties
Property Value Standard Test
Density ~1 Internal Test
Water Absorption (Immersed, 23°C) 2.8% ISO 62
Hardness (Shore D, 23°C) 45 ISO 868

Processing Conditions

Parameter Value
Melt Temperature Range 210–230°C
Mold Temperature Range 20–60°C
Drying Time (Air Oven, Thin Layer) 8 hours
Drying Temperature 70°C
Processing Moisture Content <0.2%

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