Brand: Bostik
Product Number: Thermelt 867 HV Black
Technology: Polyamide Hot Melt Resin
Color: Black
Cure Type: Low-Pressure Molding
Package Size: Pellets
Shelf Life: 18 months
Bostik Thermelt 867 HV Black is a pure copolymer polyamide hot melt resin, designed for low-pressure molding applications. It is non-reactive, solvent-free, and optimized for molding electronic/electrical components. This adhesive provides high flexibility, excellent impact resistance, and superior dielectric strength. It complies with RoHS regulations and is free from phthalates.
| Property | Value | Standard Test |
|---|---|---|
| Viscosity (220°C, SC4, 50 RPM) | 10.0–14.0 Pa.s | ASTM D3236 |
| Softening Point | 175–190°C | ASTM D3461 |
| Commercial Shape | Pellets | — |
| Property | Value | Standard Test |
|---|---|---|
| Maximum Tensile Strength (50 mm/min, dry) | 7.8 MPa | ISO 527 |
| Yield Strength (50 mm/min, dry) | — | ISO 527 |
| Young’s Modulus (50 mm/min, dry) | 70 MPa | ISO 527 |
| Elongation at Break (50 mm/min, dry) | 450% | ISO 527 |
| Property | Value | Standard Test |
|---|---|---|
| Dielectric Strength | IEC 60243-1 | |
| Volume Resistivity | IEC 60093 | |
| Comparative Tracking Index (CTI) | 0 V | IEC 60112 |
| Property | Value | Standard Test |
|---|---|---|
| Vicat Softening Temperature (A120) | 57°C | ISO 306 |
| Glass Transition Temperature | -35°C | ISO 11357-2 |
| Property | Value | Standard Test |
|---|---|---|
| Hardness (Shore D) | 32 | ISO 868 |
| Density | 0.98 | ISO 1183 |
| Water Absorption (Saturation, 23°C) | 2.8% | ISO 62 |
| Glow Wire Flammability Index (GWFI) (2.80–3.00 mm thickness) | 960°C | IEC 60695-2-12 |
| Glow Wire Ignition Temperature (GWIT) (2.80–3.00 mm thickness) | 700°C | IEC 60695-2-13 |
| Flammability (UL94) | V-0 | IEC 60695-11-10 |
| Parameter | Value |
|---|---|
| Melt Temperature Range | 210–230°C |
| Mold Temperature Range | 20–60°C |
| Drying Time (Dehumidified Dryer) | 4–6 hours |
| Drying Temperature | 70°C |
| Processing Moisture Content | <0.2% |
Stronger Bonding. Cleaner Process. Reliable Performance. If you are looking for an adhesive that combines high adhesion strength, flexibility, and electronic safety, 3320-80 is the
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
As the year draws to a close and the Christmas season arrives, Avantek Viet Nam would like to extend our warmest Christmas greetings to all our valued customers, partners, and friends.
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