-Item Name: LOCTITE® ECCOBOND UF 9000AG-061
-Manufacturer: Henkel
-Technologies: Epoxy
-Color: Black
-Cure Type: Heat cure
-Package Size: Contact to Avantek for details.
-Shelf Life: 12 months
LOCTITE® ECCOBOND UF 9000AG-061 is a black, one-component epoxy underfill encapsulant designed for FCBGA and Cu pillar applications. It provides fast flow, low coefficient of thermal expansion (CTE), and long work life, making it ideal for advanced semiconductor packaging. The material forms a rigid, self-filleting protective seal, enhancing solder joint reliability by dissipating stress and ensuring excellent electrical, thermal, and moisture resistance.
| Properties | Uncured State (Before Mixing) |
|---|---|
| Appearance | Black liquid |
| Specific Gravity (g/cm³) | 1.74 |
| Viscosity (Brookfield, 25°C, CP51 @ 5 rpm) | 11,930 mPa·s (cP) |
| Work Life (25°C) | 24 hours |
| Shelf Life (-40°C) | 365 days |
| Properties | Cured State (After Mixing) |
|---|---|
| Cure Schedule | 15 min ramp to 100°C, 90 min hold @ 100°C + 15 min ramp to 165°C, 2 hr hold @ 165°C |
| Alternate Cure Schedule | 30 min ramp to 90°C, 4 hr hold @ 90°C + 30 min ramp to 150°C, 2 hr hold @ 150°C |
| Coefficient of Thermal Expansion (CTE) – Below Tg | 19 ppm/°C |
| Coefficient of Thermal Expansion (CTE) – Above Tg | 62 ppm/°C |
| Glass Transition Temperature (Tg) by TMA | 135°C |
| Glass Transition Temperature (Tg) by DMA | 160°C |
| Storage Modulus (DMA @ 25°C) | 15 GPa (15,000 N/mm², 2.18×10⁶ psi) |
| Storage Modulus (DMA @ 250°C) | 0.4 GPa (400 N/mm², 58,000 psi) |
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Avantek Viet Nam is a dynamic MRO, direct materials and equipment supplier that brings advanced technological solutions to maximize satisfaction of customers.
We are expert in import and export of adhesives, accessories and equipment in both domestic and cosmetic industrial fields, production and technology research and development.
Our solutions promise to bring best optimal effectiveness along with competitive prices, excellent customer services, dedicated on-site support.
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