Brand: Everwide
Product Number: JC711-13
Technology: One-Component Epoxy Adhesive
Color: Red
Cure Type: Heat Curing
Package Size: Contact us for details
Shelf Life: 6 months
Everwide JC711-13 is a one-component epoxy adhesive designed for chip bonding in electronic applications. It features medium viscosity, high thixotropy, and the ability to cure quickly at low temperatures. The adhesive is suitable for screen printing and dispensing applications, offering strong curing shapes without stringing or slumping, even at high-speed dispensing and small dot applications. The cured resin demonstrates excellent adhesion, electrical insulation, chemical resistance, and solvent resistance, making it ideal for SMT processes and electronic encapsulation.
| Property | JC711-13 |
|---|---|
| Appearance | Liquid |
| Color | Red |
| Viscosity (25°C, S14 10rpm, cps) | 80,000–150,000 |
| Thixotropic Index | ≥6 |
| Property | Value |
|---|---|
| Pot Life (25°C) | 7 days |
| Through Cure Time (120°C, Hot Plate) | 180 sec |
| Through Cure Time (150°C, Hot Plate) | 120 sec |
| Through Cure Time (180°C, Hot Plate) | 90 sec |
| Property | Value |
|---|---|
| Glass Transition Temperature (Tg) (TMA) | 125°C |
| CTE (<Tg), µm/m/°C | 64 |
| CTE (>Tg), µm/m/°C | 215 |
| Specific Heat (0°C) | 4.43 J/g°C |
| Specific Heat (25°C) | 4.56 J/g°C |
| Specific Heat (50°C) | 4.80 J/g°C |
| Specific Heat (75°C) | 5.04 J/g°C |
| Specific Heat (100°C) | 5.20 J/g°C |
| Durometer Hardness (Shore D) | 86 |
| Specific Gravity | 1.35 |
| Water Absorption (25°C, 24 hr) | 0.23% |
| Water Absorption (80°C, 24 hr) | 1.50% |
| Water Absorption (97°C, 1.5 hr) | 0.60% |
| Shear Strength (Copper vs. Al) | 316 kg/cm² |
| Chip Thrust Test (0603+FR4, 25°C) | 2.9 kg |
| Chip Thrust Test (Diode+FR4, 25°C) | 2.4 kg |
| Chip Thrust Test (IC+FR4, 25°C) | 7.8 kg |
| Chip Thrust Test (MLCC+FR4, 25°C) | 3.7 kg |
| Chip Hot Thrust Test (0805, 25°C) | 3.4 kg |
| Chip Hot Thrust Test (0805, 80°C) | 3.8 kg |
| Chip Hot Thrust Test (0805, 120°C) | 3.3 kg |
| Chip Hot Thrust Test (0805, 180°C) | 1.7 kg |
| Chip Hot Thrust Test (0805, 240°C) | 1.1 kg |
| Chip Hot Thrust Test (0805, 280°C) | 0.9 kg |
| Degradation Temperature (TGA, 10°C/min) | 337°C |
| Weight Loss Ratio @ 100°C | 0.65% |
| Weight Loss Ratio @ 150°C | 0.79% |
| Weight Loss Ratio @ 200°C | 2.27% |
| Weight Loss Ratio @ 250°C | 2.71% |
| Weight Loss Ratio @ 300°C | 3.53% |
| Weight Loss Ratio @ 350°C | 5.92% |
| Thermal Conductivity | 0.3 W/mK |
| Thermal Resistance | 0.01 m²K/W |
| Surface Resistivity | 4.5 × 10¹⁴ ohm |
| Volume Resistivity (Original) | 4.5 × 10¹⁵ ohm-cm |
| Volume Resistivity (100°C, Boiling, 2 hr) | 3.3 × 10¹⁵ ohm-cm |
| Volume Resistivity (40°C, 95%RH, 100V, 96 hr) | 2.2 × 10¹⁴ ohm-cm |
| Volume Resistivity (85°C, 85%RH, 50V, 1,000 hr) | 2.4 × 10¹⁴ ohm-cm |
| Dielectric Constant (100 kHz) | 4.1 |
| Dielectric Constant (1 MHz) | 3.9 |
| Dielectric Constant (10 MHz) | 3.8 |
| Dielectric Constant (100 MHz) | 3.7 |
| Dielectric Strength | 22 kV/mm |
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