Applications

Everwide JC711-6 One-Component Epoxy for Chip Bonding

Brand: Everwide
Product Number: JC711-6
Technology: One-Component Epoxy Adhesive
Color: Red
Cure Type: Heat Curing
Package Size: Contact us for details
Shelf Life: 8 months

Product Description

Everwide JC711-6 is a one-component epoxy adhesive designed for chip bonding in electronic applications. It features medium viscosity, high thixotropy, and the ability to cure quickly at low temperatures. The adhesive is suitable for screen printing and dispensing applications, offering strong curing shapes without stringing or slumping, even at high-speed dispensing and small dot applications. The cured resin demonstrates excellent adhesion, electrical insulation, chemical resistance, and solvent resistance, making it ideal for SMT processes and electronic encapsulation.

Key Features

  • Solvent-free, non-volatile system
  • Excellent electrical insulation retention in high humidity environments
  • Low stress, low shrinkage, and low water absorption
  • Medium viscosity with high thixotropy, offering sag resistance
  • Fast curing at low temperatures, increasing production efficiency
  • Complies with 2011/65/EU RoHS regulations
  • Meets chlorine < 900ppm, bromine < 900ppm, chlorine + bromine < 1500ppm limits

Recommended Applications

  • Chip bonding in electronic devices
  • SMT (Surface Mount Technology) assembly processes
  • Encapsulation of electronic components
  • Applications requiring fast, strong adhesion with minimal shrinkage

Technical Data

Typical Uncured Properties
Property JC711-6
Appearance Liquid
Color Red
Viscosity (25°C, S14 3rpm, cps) ≥550,000
Thixotropic Index ≥7.5
Curing Properties
Property Value
Pot Life (25°C) 7 days
Through Cure Time (Hot Plate, 120°C) 100 sec
Typical Cured Properties
Property Value
Glass Transition Temperature (Tg) (TMA) 125°C
Glass Transition Temperature (Tg) (DSC) 124°C
CTE (<Tg), µm/m/°C 64
CTE (>Tg), µm/m/°C 215
Specific Heat (0°C) 4.43 J/g°C
Specific Heat (25°C) 4.56 J/g°C
Specific Heat (50°C) 4.80 J/g°C
Specific Heat (75°C) 5.04 J/g°C
Specific Heat (100°C) 5.20 J/g°C
Durometer Hardness (Shore D) 86
Specific Gravity 1.35
Water Absorption (25°C, 24 hr) 0.23%
Water Absorption (80°C, 24 hr) 1.50%
Water Absorption (97°C, 1.5 hr) 0.60%
Degradation Temperature (TGA, 10°C/min) 337°C
Weight Loss Ratio @ 100°C 0.65%
Weight Loss Ratio @ 150°C 0.79%
Weight Loss Ratio @ 200°C 2.27%
Weight Loss Ratio @ 250°C 2.71%
Weight Loss Ratio @ 300°C 3.53%
Weight Loss Ratio @ 350°C 5.92%
Thermal Conductivity 0.3 W/mK
Thermal Resistance 0.01 m²K/W
Volume Resistivity 4.5 × 10¹⁵ ohm-cm
Surface Resistivity 4.5 × 10¹⁴ ohm
Dielectric Constant (1 kHz) 3.2

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