
FX219G5 – Silicone Potting & Encapsulation Compound
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
Brand: Everwide
Product Number: JC711-6
Technology: One-Component Epoxy Adhesive
Color: Red
Cure Type: Heat Curing
Package Size: Contact us for details
Shelf Life: 8 months
Everwide JC711-6 is a one-component epoxy adhesive designed for chip bonding in electronic applications. It features medium viscosity, high thixotropy, and the ability to cure quickly at low temperatures. The adhesive is suitable for screen printing and dispensing applications, offering strong curing shapes without stringing or slumping, even at high-speed dispensing and small dot applications. The cured resin demonstrates excellent adhesion, electrical insulation, chemical resistance, and solvent resistance, making it ideal for SMT processes and electronic encapsulation.
| Property | JC711-6 |
|---|---|
| Appearance | Liquid |
| Color | Red |
| Viscosity (25°C, S14 3rpm, cps) | ≥550,000 |
| Thixotropic Index | ≥7.5 |
| Property | Value |
|---|---|
| Pot Life (25°C) | 7 days |
| Through Cure Time (Hot Plate, 120°C) | 100 sec |
| Property | Value |
|---|---|
| Glass Transition Temperature (Tg) (TMA) | 125°C |
| Glass Transition Temperature (Tg) (DSC) | 124°C |
| CTE (<Tg), µm/m/°C | 64 |
| CTE (>Tg), µm/m/°C | 215 |
| Specific Heat (0°C) | 4.43 J/g°C |
| Specific Heat (25°C) | 4.56 J/g°C |
| Specific Heat (50°C) | 4.80 J/g°C |
| Specific Heat (75°C) | 5.04 J/g°C |
| Specific Heat (100°C) | 5.20 J/g°C |
| Durometer Hardness (Shore D) | 86 |
| Specific Gravity | 1.35 |
| Water Absorption (25°C, 24 hr) | 0.23% |
| Water Absorption (80°C, 24 hr) | 1.50% |
| Water Absorption (97°C, 1.5 hr) | 0.60% |
| Degradation Temperature (TGA, 10°C/min) | 337°C |
| Weight Loss Ratio @ 100°C | 0.65% |
| Weight Loss Ratio @ 150°C | 0.79% |
| Weight Loss Ratio @ 200°C | 2.27% |
| Weight Loss Ratio @ 250°C | 2.71% |
| Weight Loss Ratio @ 300°C | 3.53% |
| Weight Loss Ratio @ 350°C | 5.92% |
| Thermal Conductivity | 0.3 W/mK |
| Thermal Resistance | 0.01 m²K/W |
| Volume Resistivity | 4.5 × 10¹⁵ ohm-cm |
| Surface Resistivity | 4.5 × 10¹⁴ ohm |
| Dielectric Constant (1 kHz) | 3.2 |

Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.

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As the year draws to a close and the Christmas season arrives, Avantek Viet Nam would like to extend our warmest Christmas greetings to all our valued customers, partners, and friends.

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