Applications

DOWSIL™ EA-7100- Adhesive – Automotive electronics

  • Item Name: DOWSIL™ EA-7100 Adhesive
  • Manufacturer: Dow Chemical Company
  • Technologies: Polydimethylsiloxane (Thermal Radical Cure Silicone)
  • Color: Not specified
  • Cure Type: Heat cure with secondary moisture cure
  • Package Size: Contact to Avantek for details.
  • Shelf Life: Contact to Avantek for details.

1. Product Overview

DOWSIL™ EA-7100 is a one-part, thermal radical cure adhesive designed for strong adhesion to a wide range of substrates. It provides faster cure times, low voiding, and excellent adhesion in harsh environments.

2. Applications

  • Automotive electronics (ECUs, sensors, lighting, displays)
  • Lid sealing, base plate attachment, gasketing, connector sealing
  • Suitable for manual or automated dispensing

3. Typical Properties

Property Unit Value
Viscosity cP 360,000
Thixotropy 5.8
Pre-Assembly Time min 60
Heat Cure Time @ 100°C min 15
Specific Gravity (Cured) 1.09
Tensile Strength psi (MPa) 490 (3.4)
Elongation % 260
Durometer (Shore A) 43
Lap Shear Strength (Aluminum) psi (MPa) 350 (2.4)
Lap Shear Strength (PBT) psi (MPa) 375 (2.6)
CTE (Coefficient of Thermal Expansion) ppm/°C 247
Volume Resistivity Ohm-cm 9E+14
Dielectric Strength volts/mil (kV/mm) 437 (17)
Dielectric Constant (100 Hz / 100 kHz) 2.96 / 2.91
Dissipation Factor (100 Hz / 100 kHz) 0.002 / 0.004

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