FX219G5 – Silicone Potting & Encapsulation Compound
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
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Item No: 2214 Non-Metallic Filled
Manufacturer: 3M™ Scotch-Weld™
Technologies: Epoxy
Color: Cream – Tan
Cure Type: Heat Cure
Package Sizes: 6 fl oz
Shelf Life: 12 months
3M™ Scotch-Weld™ Epoxy Adhesive 2214, Non-Metallic Filled, is a paste consistency epoxy adhesive designed for structural bonding applications requiring high-temperature resistance. This one-part, heat-curing epoxy adhesive is specifically formulated to bond metals and high-temperature plastics, such as fiberglass-reinforced plastic, polyester, and phenolics. The non-metallic filled formula offers strong adhesion without conductivity, and its paste consistency allows for precise application and controlled bondline thickness. This adhesive is also UL 94 HB rated, ensuring compliance with flammability resistance requirements.
| Attribute Name | Value |
|---|---|
| Color | Cream – Tan¹ |
| Viscosity | >1,000,000 cP² |
| Net Weight | 9.6 lb/gal |
| Base | Modified Epoxy |
¹ Colors may vary from nearly white to yellow/amber; performance is not affected.
² Due to its thixotropic paste nature, Brookfield viscosity is over 1,000,000 cP.
| Attribute Name | Value |
|---|---|
| Cured Color | Cream – Tan |
| Modulus | 700,000 lb/in² |
| Shore D Hardness (ASTM D2240) | 85 |
| Attribute Name | Test Method | Value |
|---|---|---|
| Overlap Shear Strength (Cold Rolled Steel, MEK/Abrade/MEK, 7 Days Dwell Time) | ASTM D1002, ISO 4587 | 2,200 lb/in²¹ |
| T-Peel Adhesion (Aluminum) | ASTM D1876 | 7 lb/in width² |
| T-Peel Adhesion (Steel, MEK Wipe) | ASTM D1876 | 12 lb/in width² |
| Elongation at Break | – | <2% |
| Tensile Strength at Break | – | 9,000 lb/in² |
¹ 25 mm (1″) wide, 12.7 mm (1/2″) overlap samples, with 0.13-0.20 mm (5-8 mil) bondline thickness.
² Measured using etched 2024-T3 clad aluminum panels bonded with a 508 mm/min (20 in/min) separation rate.
| Attribute Name | Test Condition | Value |
|---|---|---|
| Coefficient of Thermal Expansion | -30 ~ 100°C | 130 x 10⁻⁶ m/m/°C |
| Thermal Conductivity | – | 0.121 (btu-ft)/(h-ft²-°F) |
| Arc Resistance | ASTM D495 | 26 seconds |
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
As the year draws to a close and the Christmas season arrives, Avantek Viet Nam would like to extend our warmest Christmas greetings to all our valued customers, partners, and friends.
Partial Gasket & Seal Strategies Using Henkel Loctite SI 5910
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