Applications

LOCTITE® ABLESTIK ABP 8068TB – Silver-filled/Semi-sintering

• Item Name: LOCTITE® ABLESTIK ABP 8068TB
• Manufacturer: Henkel
• Technologies: Semi-sintering, Silver-filled
• Color: Silver liquid
• Cure Type: Heat cure
• Package Size: Contact to Avantek for details.
• Shelf Life: 12 months

1. Product Overview

LOCTITE ABLESTIK ABP 8068TB is a silver-filled, semi-sintering die attach adhesive formulated for semiconductor packages with high thermal and electrical requirements. It provides excellent adhesion, low stress, and high thermal stability, making it a suitable alternative to solder pastes. Compared to its predecessor, LOCTITE ABLESTIK ABP 8068TA, this version offers improved resin bleed control.

2. Applications

  • Semiconductor packaging: SIP, QFN, LGA, HBLED
  • Conductive adhesive for die attach
  • High-reliability applications requiring thermal and electrical stability

3. Typical Properties

Uncured Properties

Property Value
Thixotropic Index (0.5/5 rpm) 5.5
Viscosity (Brookfield CP51, 25°C) 11,500 mPa·s
Work Life @ 25°C 16 hours
Open Time @ 25°C 2 hours
Shelf Life @ -40°C 365 days

Curing Performance

Die Size Cure Profile
<5 x 5 mm 25°C to 130°C (30-60 min), ramp to 200°C (120 min) in N2 or air oven
>5 x 5 mm 25°C to 130°C (120 min), ramp to 200°C (120 min) in N2 or air oven
Alternative Cure (Ag, Au, PPF substrates) 25°C to 130°C (30 min), ramp to 175°C (60 min) in N2 or air oven

Cured Properties

Property Value
Glass Transition Temperature (Tg) 25°C
CTE Below Tg 25 ppm/°C
CTE Above Tg 103 ppm/°C
Thermal Conductivity 100 W/m-K
Moisture Absorption 0.21%
Volume Resistivity 7×10⁻⁶ Ω·cm

Shear Strength

Die Size Substrate Shear Strength (kg-f)
1 x 1 mm Ag 1.5
Cu 1.6
PPF 1.2
2 x 2 mm Ag 5.0
Cu 6.5
PPF 4.5
3 x 3 mm Ag 10.9
Cu 10.8
PPF 10.0

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