Applications

LOCTITE ABLESTIK ABP 8910T – BMI Hybrid

  • Item Name: LOCTITE ABLESTIK ABP 8910T
  • Manufacturer: Henkel
  • Technologies: BMI Hybrid
  • Color: Blue
  • Cure Type: Heat cure
  • Package Size: Contact to Avantek for details.
  • Shelf Life: 12 months

1. Product Overview

LOCTITE ABLESTIK ABP 8910T is a BMI Hybrid die attach adhesive with high thermal conductivity, electrical insulation, and high reliability. It is designed for medium to large die sizes and offers high MRT performance.

  • Technology: BMI Hybrid
  • Appearance: Blue
  • Cure Type: Heat cure
  • Filler Type: Alumina
  • Key Substrates: Copper, Silver, PPF, Alloy 42

2. Applications

  • Die attach adhesive for medium to large die sizes
  • High-reliability applications requiring high thermal performance

3. Typical Properties

Uncured Material
Property Value
Thixotropic Index (0.5/5 rpm) ≥4.5
Viscosity (Brookfield CP51, 25 °C, 5 rpm) 13,000 mPa·s (cP)
Work Life @ 25°C 24 hours
Shelf Life @ -40°C 365 days
Curing Performance
Cure Schedule Condition
Step 1 30-minute ramp to 175°C
Step 2 15 minutes at 175°C
Cured Material
Property Value
Coefficient of Thermal Expansion (CTE) (ppm/°C) Below Tg: 28, Above Tg: 96
Glass Transition Temperature (Tg) 30°C
Thermal Conductivity 1.3 W/(m·K)
Extractable Ions (ppm) Cl⁻: ≤20, Na⁺: ≤20, K⁺: ≤20
Tensile Modulus (DMTA)
Temperature Tensile Modulus (N/mm²) Tensile Modulus (psi)
-65°C 10,270 1,488,960
25°C 8,870 1,285,905
150°C 2,030 294,860
200°C 1,096 158,920
250°C 1,007 146,015
Die Shear Strength
Condition Substrate Strength (kg-f/die)
@ 25°C Silver 15.4
@ 200°C Silver 5.5
@ 250°C Silver 4.4
Post Mold Bake (PMB) Silver 4.3
Copper 16.7
PPF 2.1
Alloy 42 8.5
PMB + 5 min @ 270°C Silver 2.0
Copper 15.6
PPF 1.9
Alloy 42 8.1
PMB + Moisture Silver 1.1
Copper 4.6
PPF 1.4
Alloy 42 1.9

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