
High Performance Epoxy for Drone Manufacturing
Advanced Epoxy Adhesive Solutions for Next-Generation UAVs and Drones As UAV and drone technology continues to evolve, manufacturers require adhesive solutions that can withstand demanding
TECHNOMELT® PA 6344 is a one-component polyamide hot melt adhesive designed for low-pressure molding applications. It offers low viscosity, enabling the encapsulation of fragile components without damage. The product forms a protective barrier against environmental factors, providing heat stability, moisture resistance, and UV stability. It is suitable for exterior applications and meets UL 94 V2 flammability standards.
| Property | Value | Test Method |
|---|---|---|
| Appearance | Black | – |
| Specific Gravity (g/cm³) | 1.00 | ASTM D792 |
| Softening Point (°C) | 142 | ASTM E28 (in glycerin) |
| Molding Temperature (°C) | 190 – 230 | – |
| Operating Temperature Range (°C) | 0 – 100 | – |
| Melt Viscosity (mPa·s) | ASTM D3236 | |
| @ 200°C | 18,000 | |
| @ 210°C | 11,000 | |
| @ 225°C | 7,000 | |
| @ 240°C | 3,800 | |
| Shore Hardness (Durometer A) | 80 | ASTM D2240 |
| Elongation (%) | 700 | ASTM D638 |
| E-modulus (N/mm²) | 27.6 (4000 psi) | ASTM D638 |
| Temperature Creep Resistance (°C) | 120 | Henkel Method MH 11 |
| Glass Transition Temperature (°C) | 0 | DSC Second Run |
| Water Absorption (%), 1 day | 0.5 | – |
| Water Absorption (%), 7 days | 1.4 | – |
| Property | Value | Test Method |
|---|---|---|
| Dielectric Constant / Dissipation Factor | Open-ended coaxial probe | |
| @ 1 MHz | 3.18 / 0.0729 | |
| @ 1 GHz | 2.84 / 0.0214 | |
| @ 1.8 GHz | 2.81 / 0.0188 | |
| @ 5.0 GHz | 2.78 / 0.0138 | |
| @ 10 GHz | 2.77 / 0.0099 | |
| @ 20 GHz | 2.76 / 0.0078 | |
| Dielectric Strength (kV/mm) | 23 | ASTM D149 |
| Volume Resistivity (ohm·cm) | 4.8 x 10¹² | ASTM D257 |

Advanced Epoxy Adhesive Solutions for Next-Generation UAVs and Drones As UAV and drone technology continues to evolve, manufacturers require adhesive solutions that can withstand demanding

Stronger Bonding. Cleaner Process. Reliable Performance. If you are looking for an adhesive that combines high adhesion strength, flexibility, and electronic safety, 3320-80 is the

Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.

FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
Avantek Viet Nam is a dynamic MRO, direct materials and equipment supplier that brings advanced technological solutions to maximize satisfaction of customers.
We are expert in import and export of adhesives, accessories and equipment in both domestic and cosmetic industrial fields, production and technology research and development.
Our solutions promise to bring best optimal effectiveness along with competitive prices, excellent customer services, dedicated on-site support.
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