Applications

LOCTITE ABLESTIK ICP 9000

  • Item Name: LOCTITE ABLESTIK ICP 9000
  • Manufacturer: Henkel
  • Product Category: Electrically Conductive Adhesive (ECA)
  • Technologies: Semi-sintering, Electrically Conductive, Heat Cure
  • Applications: High-power and high-temperature electronic device assembly, solder replacement for Sn/Pb and Au/Sn, Power IC, SiC power devices, GaAs and GaN die transistors
  • Color: Silver liquid
  • Cure Type: Heat cure
  • Package Size: Contact Avantek for details.
  • Shelf Life: 12 months (1 year)

1. Product Overview

LOCTITE ABLESTIK ICP 9000 is a silver-filled, semi-sintering adhesive designed for high-power and high-temperature electronic device assembly. It offers:

  • One-component formulation
  • Electrically conductive properties
  • Good electrical stability
  • No resin bleed-out
  • High thermal stability and reliability
  • Solder replacement for Sn/Pb and Au/Sn solder

2. Applications

  • Component assembly (ECA)
  • Power IC, SiC power devices, GaAs and GaN die transistors
  • Replacement for solder pastes

3. Typical Properties

Uncured Properties
Property Value
Appearance Silver liquid
Filler Type Silver
Viscosity @ 5 rpm (Brookfield) 11,500 mPa·s (cP)
Thixotropic Index (0.5/5 rpm) 5.5
Work Life @ 25°C 16 hours
Open Time @ 25°C 2 hours
Shelf Life @ -40°C 365 days
Curing Properties
Cure Condition Time & Temperature
Conventional Oven (<5×5 mm die) 200°C for 1 hour
Conventional Oven (>5×5 mm die) 130°C for 120 min → 200°C for 120 min
Alternate Cure (Ag, Au, PPF substrates) 130°C for 30 min → 175°C for 60 min
Cured Properties
Property Value
Glass Transition Temperature (Tg) 25°C
Thermal Conductivity 100 W/m-K
Volume Resistivity 7 × 10⁻⁶ ohm-cm
Moisture Absorption 0.21%
Shear Strength @ 260°C
Die Size Ag (kg-f) Cu (kg-f) PPF (kg-f)
1 × 1 mm 1.5 1.6 1.2
2 × 2 mm 5.0 6.5 4.5
3 × 3 mm 10.9 10.8 10.0
Thermal Resistance (In-Package)
Substrate Resistance (K/W)
Ag 0.45
PPF 0.45
Outgassing Properties (NASA Standard)
Property Value
TML 0.2%
CVCM 0.02%
WVR 0.03%

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