FX219G5 – Silicone Potting & Encapsulation Compound
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
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Brand: Insulcast
Package Sizes: Contact us for details.
Shelf Life: 12 months
RTVS 27 HTC is a low-viscosity, UL 94V-0 certified, thermally conductive RTV silicone compound. It is specifically formulated for potting dense electronic components that require efficient heat dissipation. This reversion-resistant material maintains high thermal conductivity and strong mechanical properties, ensuring reliable long-term performance in harsh environments.
✅ Low Viscosity: Enables easy flow and penetration into intricate areas.
✅ High Thermal Conductivity: 1.0 W/m·K for efficient heat dissipation.
✅ UL 94V-0 Flame Retardant: Ensures high safety compliance.
✅ Reversion Resistant: Maintains mechanical integrity over time.
✅ Wide Service Temperature Range: -55°C to +232°C, making it ideal for extreme environments.
🔹 Electronic Potting & Encapsulation: Protects transformers, PCBs, and sensors.
🔹 Power Electronics & Heat Management: Ensures effective thermal transfer for high-power components.
🔹 Aerospace & Automotive Electronics: Provides reliable performance under extreme conditions.
🔹 Encapsulation for High-Density Components: Ideal for applications requiring enhanced heat dissipation.
| Property | Part A | Part B | Mixed | Test Standard |
|---|---|---|---|---|
| Color | Dark Grey | White | – | Visual |
| Viscosity (cP) | 8,000 | 3,300 | 6,000 | ASTM D1084 |
| Specific Gravity | 1.98 | 1.96 | – | – |
| Mix Ratio (by Weight/Volume) | 1:1 | – | – | – |
| Pot Life (100g mass) | 1 hour | – | – | – |
| Property | Value | Test Standard |
|---|---|---|
| Hardness (Shore A) | 60 | ASTM D2240 |
| Tensile Strength (psi / MPa) | 500 / 3.4 | ASTM D412 |
| Tensile Elongation (%) | 60 | ASTM D412 |
| Coefficient of Thermal Expansion (°C⁻¹) | 17 × 10⁻⁵ | – |
| Thermal Conductivity (W/m·K) | 1.0 | – |
| Flammability Rating | UL 94V-0 | – |
| Service Temperature Range (°C) | -55 to +232 | – |
| Property | Value | Test Standard |
|---|---|---|
| Dielectric Strength (V/mil) | 500 | ASTM D149 |
| Dielectric Constant (1 kHz) | 4.0 | ASTM D150 |
| Dissipation Factor (1 kHz) | 0.0075 | ASTM D150 |
| Volume Resistivity (ohm-cm) | 1 × 10¹⁵ | ASTM D257 |
| Cure Method | Time & Temperature |
|---|---|
| Room Temperature Cure | 24 hours at 25°C (77°F) |
| Accelerated Cure | 2 hours at 60°C (140°F) |
| Rapid Cure | 30 minutes at 95°C (203°F) |
| High-Speed Cure | 15 minutes at 120°C (248°F) |
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
As the year draws to a close and the Christmas season arrives, Avantek Viet Nam would like to extend our warmest Christmas greetings to all our valued customers, partners, and friends.
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