FX219G5 – Silicone Potting & Encapsulation Compound
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
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Brand: Insulcast
Package Sizes: Contact us for details.
Shelf Life: 12 months
Insulcast RTVS 27 FC is a low-viscosity, UL 94V-0 flame-retardant RTV silicone compound designed for potting and casting applications. It features rapid curing at room temperature, low-temperature flexibility, high-temperature resistance, and excellent electrical properties. The material is easily removable, allowing for component replacement or repair in sensitive applications.
✅ Low Viscosity: Ensures easy flow into intricate geometries.
✅ Flame Retardant: Meets UL 94V-0 fire safety requirements.
✅ Reversion Resistant: Maintains stability in extreme environments.
✅ Fast Cure Time: Achieves tack-free status in 30 minutes at 25°C.
✅ Good Electrical Properties: High dielectric strength and volume resistivity.
✅ Easy to Remove: Allows for component replacement or repair.
🔹 Electronic Potting & Casting: Protects transformers, sensors, and circuit boards.
🔹 Aerospace & Automotive Electronics: Provides thermal and electrical insulation.
🔹 Industrial Equipment: Used in high-performance electronics and power systems.
🔹 Encapsulation Applications: Ensures reliable insulation for sensitive components.
| Property | Part A | Part B | Mixed | Test Standard |
|---|---|---|---|---|
| Color | Dark Grey | Buff (Neutral) | – | Visual |
| Viscosity (cP) | 3,000 | 2,800 | 2,900 | ASTM D1084 |
| Specific Gravity | 1.50 | 1.50 | – | – |
| Mix Ratio (by Weight/Volume) | 1:1 | – | – | – |
| Pot Life (100g mass) | <5 min | – | – | – |
| Tack-Free Time (25°C) | 30 min | – | – | – |
| Gel Time (25°C) | 3-5 min | – | – | – |
| Property | Value | Test Standard |
|---|---|---|
| Hardness (Shore A) | 60 | ASTM D2240 |
| Tensile Strength (psi / MPa) | 500 / 3.4 | ASTM D412 |
| Tensile Elongation (%) | 135 | ASTM D412 |
| Tear Strength (lb/in / N/mm) | 18 / 3.15 | ASTM D624 |
| Coefficient of Thermal Expansion (°C⁻¹) | 22 × 10⁻⁵ | – |
| Glass Transition Temperature (Tg) (°C) | -52 | – |
| Thermal Conductivity (W/m·K) | 0.31 | ASTM D5470 |
| Service Temperature Range (°C) | -55 to 204 | – |
| Property | Value | Test Standard |
|---|---|---|
| Dielectric Strength (V/mil) | 550 | ASTM D149 |
| Dielectric Constant (1 kHz) | 3.0 | ASTM D150 |
| Dissipation Factor (1 kHz) | 0.004 | ASTM D150 |
| Volume Resistivity (ohm-cm) | 1.0 × 10¹⁵ | ASTM D257 |
| Cure Method | Time & Temperature |
|---|---|
| Room Temperature Cure | 1 hour at 25°C (77°F) |
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
As the year draws to a close and the Christmas season arrives, Avantek Viet Nam would like to extend our warmest Christmas greetings to all our valued customers, partners, and friends.
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